2007
DOI: 10.1016/j.tsf.2006.09.034
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Effect of organic additives on the magnetic properties of electrodeposited CoNiP hard magnetic films

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Cited by 14 publications
(8 citation statements)
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“…The pH value of electrolytic solution was fixed as 6.0 by mixing ammonia solution and electroplating process was carried out with current density 3 mA/cm 2 . The copper or cathode was carefully removed from the bath after 15 min and dried for few minutes [22][23] . The surface nature of Ni-Fe-W films was characterized by Scanning Electron Microscope.…”
Section: Methodsmentioning
confidence: 99%
“…The pH value of electrolytic solution was fixed as 6.0 by mixing ammonia solution and electroplating process was carried out with current density 3 mA/cm 2 . The copper or cathode was carefully removed from the bath after 15 min and dried for few minutes [22][23] . The surface nature of Ni-Fe-W films was characterized by Scanning Electron Microscope.…”
Section: Methodsmentioning
confidence: 99%
“…When phosphorus supplemented magnetic alloys were deposited with organic additives like urea, thiourea it adlib the magnetic properties. [13,14] Hence the present work is keen to prepare CoNiWP alloy film on copper substrate at different current density using electro deposition method. The influence of phosphorous on the properties of electrodeposited films was discussed by studying their structural, morphological, and magnetic properties.…”
Section: Introductionmentioning
confidence: 99%
“…It may act as a leveling agent [10,11] due to the selective adsorption of urea molecules on the specific crystal planes of metal electrode [8,12], but it is also a complexing agent for metal ions [9]. Earlier, a saturated water solution of urea oxalate was used as an electrolyte for the electrodeposition of Mn, as well as metals which were difficult to deposit from aqueous baths (technetium and actinium) [13].…”
Section: Introductionmentioning
confidence: 99%