2012
DOI: 10.1016/j.matchemphys.2012.09.038
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Effect of oxidation temperature on physical properties of thermally grown oxide on GaN in N2O ambient

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Cited by 7 publications
(3 citation statements)
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“…After 5 h of oxidation, the peak intensity of AlGaN nanowires is almost the same as that of 3 h of oxidation, suggesting that oxidation degree of AlGaN nanowires has saturated. When the oxidation temperature was less than 700 • C, only Al-N bond in AlGaN nanowire can be oxidized, and the Ga-N bond cannot be oxidized [26,27]. In other words, the AlGaN nanowires were transformed into AlGaON.…”
Section: Resultsmentioning
confidence: 99%
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“…After 5 h of oxidation, the peak intensity of AlGaN nanowires is almost the same as that of 3 h of oxidation, suggesting that oxidation degree of AlGaN nanowires has saturated. When the oxidation temperature was less than 700 • C, only Al-N bond in AlGaN nanowire can be oxidized, and the Ga-N bond cannot be oxidized [26,27]. In other words, the AlGaN nanowires were transformed into AlGaON.…”
Section: Resultsmentioning
confidence: 99%
“…Previous studies on the oxidation process of GaN have suggested that GaN was scarcely oxidized below 700 • C in an oxygen atmosphere. The Ga-N bond cannot be easily broken because there was no change in the XRD peak before and after oxidation [13,26,27]. However, when the temperature was elevated to above 700 • C, the GaN can be oxidized gradually by increasing the temperature and time.…”
Section: Methodsmentioning
confidence: 99%
“…Therefore, in recent years, the control of the oxidation state of the interface and the atomic arrangement have been reported. 4,[19][20][21][22][23][24][25] In particular, the gallium oxide layer has been analyzed by X-ray photoelectron spectroscopy (XPS) 26,27) and observed by cross-sectional transmission electron microscopy (TEM). 9,[28][29][30][31] Although many crosssectional TEM observations have been reported, making a detailed analysis of the interface between the amorphous and crystalline layers is difficult because of the damage that occurred during the sample preparation and crystallization of the material; this damage was caused by electron beam irradiation of Al 2 O 3 /GaN.…”
mentioning
confidence: 99%