“…The CTE of epoxy can be greatly reduced with the incorporation of high thermal conductive fillers, such as metal powder, carbon black, and other fillers, but generally required high filler loading, which leads to another obstacle, viscosity increment on the polymer matrix, which resulted in difficulties during processing. Gathering from previous studies, the filler loading required to give tuneable effect on the electrical and thermal conductivity of epoxy resin will require 10-20 vol.% of filler loading [13,14], depending on several 2 International Journal of Polymer Science factors, including processing methodology, particle size of filler [15][16][17][18], particle distribution [19], and particle aspect ratio [20,21]. Nanofillers, such as graphene nanoplatelets, are one of the promising steps to greatly reduce the filler loading, down to 0.01-1 vol.%, as reported previously, due to its 2D geometry and particle size, hence greatly reducing the percolation threshold [6,22] and thermal conductivity [23][24][25].…”