Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Ha, Sang-Su; Park, Jongwoo; Jung, Seung‐Boo

doi:10.2320/matertrans.m2011107

Cited by 23 publications

(12 citation statements)

References 14 publications

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“…[20][21][22][23][24] However, in this current study, thin (~2 μm) and uniform IMC layers formed at both interfaces, in spite of the TH test for 500 h (Fig. 6).…”

Section: Resultscontrasting

confidence: 54%

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Yoon

Jung

2016

Mater. Trans.

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In this study, electrodes on a exible printed circuit board (FPCB) and rigid printed circuit board (RPCB) were bonded together by thermo-compression (TC) bonding, using a Sn-3.0Ag-0.5Cu solder as an interlayer. In order to investigate the hygrothermal reliability of the TC bonded FPCB/RPCB joints, a temperature-humidity (TH) test of 85 C/85% relative humidity, and a 90 peel test, were conducted. The relationships between the TH treatment, peel strength, and failure analysis result were discussed. The peel strength signi cantly decreased as TH time increased. In contrast, a signi cant variation in electrical resistance was not observed during TH testing. Thin and uniform (Ni,Cu) 3 Sn 4 intermetallic compound (IMC) layers were formed at both FPCB/Sn-3.0Ag-0.5Cu/RPCB interfaces. After a TH test for 500 h, the thickness of the IMC layer was slightly increased. In the case of the joint without TH treatment, a fracture occurred at the polyimide of the FPCB. After the TH test, the degradation of the adhesion between the polyimide and Cu in the FPCB occurred, due to the hygrothermal treatment, resulting in a switch of failure mode, from a polyimide failure to a brittle polyimide/Cu interface failure. X-ray photoelectron spectroscopy (XPS) analyses showed that the decrease in C-O and C=O bond ratios caused a decrease in peel strength of the TC bonded FPCB-RPCB joints, after the TH test. When comparing the TH and HTS tests, the TH test signi cantly deteriorated the integrity of the TC bonded FPCB-RPCB joints.

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“…[20][21][22][23][24] However, in this current study, thin (~2 μm) and uniform IMC layers formed at both interfaces, in spite of the TH test for 500 h (Fig. 6).…”

Section: Resultscontrasting

confidence: 54%

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Yoon

Jung

2016

Mater. Trans.

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“…The drop lifetime of the ENIG joints was shorter than that of the ENEPIG joint due to the brittle IMC/Ni-P interface in the ENIG joints. 9) We found that the drop reliability of the OSP joints was superior to that of both ENIG and ENEPIG surface finishes. A similar result was reported in a previous study.…”

Section: )mentioning

confidence: 80%

Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

2016

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Board-level drop reliability testing under JEDEC (Joint Electron Device Engineering Council) drop conditions was conducted for lowtemperature Sn-58 mass%Bi solder joints. The effects of surface finish and the number of reflow processes (one, three, or five) on the drop reliability of the Sn-58Bi joints were evaluated. Three types of surface finishes were used including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). We successfully fabricated six types of drop test specimens with various surface finishes and bonding materials, and then performed the board-level drop tests. The board-level drop reliability was improved when using the composite Sn-58Bi solder with epoxy as compared to Sn-58Bi solder without epoxy. In addition, the reliability of the Sn-58Bi epoxy solder/OSP joint was better than both the ENIG and ENEPIG surface finishes. When the number of reflow processes increased, the drop reliability showed two different behaviors; specifically, the reliability of the ENIG and ENEPIG surface finishes decreased while the OSP surface finish improved. The existence of epoxy in the solder paste improved the drop reliability of the solder joints. After drop testing, cracks propagated differently with different surface finishes, namely between Ni 3 Sn 4 IMCs and the Ni-P layer for the ENIG surface finish, between Ni 3 Sn 4 IMCs and the solder bulk for the ENEPIG surface finish, and within the solder bulk for the OSP surface finish. These data show that, when it is necessary to perform repeated reflow processes for electronic components, solder joints with an OSP surface finish provide better drop test reliability results.

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“…The ImAg surface finish yielded the lowest lifetimes for all components and aging conditions. Ha, et al [28] reported that use of ImAg finish led to greater average IMC thicknesses during thermal aging relative to ENIG/ENEPIG finishes. This is likely due to the lack of a Ni diffusion barrier, and could lead to increased crack growth rates during thermal cycling.…”

Section: Fea Results and Discussionmentioning

confidence: 99%

Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

Basit

Motalab

Suhling

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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Isothermal aging causes detrimental changes in the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies. These material changes also degrade the reliability of solder joints in assemblies subjected to aging prior to field use. In the current work, we have extended our previous research on the effects of aging on lead free solder material behavior to explore the effects of prior aging on solder joint (board level) reliability in actual assemblies. Our overall objective was to develop new reliability prediction procedures that incorporate aging effects, and then to validate the new approaches through correlation with thermal cycling accelerated life testing experimental data for pre-aged assemblies.Traditional finite element based predictions for solder joint reliability during thermal cycling accelerated life testing are based on solder constitutive equations (e.g. Anand viscoplastic model) and failure models (e.g. energy dissipation per cycle model) that do not evolve with material aging. Thus, there will be significant errors in the calculations with lead free SAC alloys that illustrate dramatic aging phenomena. This work has implemented a theoretical framework for correcting this limitation and including aging effects in the reliability modeling. The developed approach involved the use of: (1) a revised set off Anand viscoplastic stress-strain relations for solder that included material parameters that evolve with the thermal history of the solder material, and (2) a revised solder joint failure criterion that included aging effects. The effects of aging on the nine Anand model parameters were determined experimentally for SAC305 lead free solder as a function of aging temperature and aging time. The revised Anand constitutive equations for solder with aging effects were then incorporated into standard finite element codes. The applied aging-aware failure criterion was based on the Morrow-Darveaux (dissipated energy based, DeltaW) approach, with both the fatigue criterion for crack initiation and the crack growth law incorporating material constants that depend on the prior aging of the solder material. Fatigue data were measured for SAC solder using uniaxial and shear test specimens that were aged for various durations and temperatures prior to cycling.The developed reliability modeling procedure has been applied to a family of assembled PBGA components. In the simulations, the packages were subjected to isothermal aging followed by thermal cycling accelerated life testing. The model were selected to reflect the board surface finish and SAC solder combination. With this approach, good correlation was obtained between the new reliability modeling procedure that includes aging and the entire set of measured solder joint reliability data that includes multiple component sizes, prior aging conditions, and board surface finishes.

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Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Cited by 23 publications

References 14 publications

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

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