Effect of POSS on the Dielectric Properties of Thermally Aged Epoxy Resin Insulating Materials

Shi, Yinjun; Zhao, Yushun; Gong, Chao; Xu, Yufan; Chen, George; Du, Bin; Li, Dengyun

doi:10.1109/tdei.2022.3194492

Cited by 9 publications

(1 citation statement)

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“…However, its intrinsic thermal conductivity is below 0.2 W (m•K) −1 , which thus impedes rapid heat conduction through the PMIA matrix. The service duration under hightemperature conditions is confined [4], where the thermally electrical breakdown would be triggered by heat accumulation [5]. In recent years, promising thermally conductive fillers such as inorganic micro-or nano-fillers of Al 2 O 3 , aluminum nitride (AlN), and boron nitride (BN) are employed for the doping in polymers, which is recognized as an applicable method to compensate for the thermally conductive performance of the single polymer [6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent

Yang

Ruan

Fan

et al. 2023

J. Phys. D: Appl. Phys.

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Encouraged by the goal of achieving net-zero carbon emission by 2050, the exploration of insulating material becomes one of the core projects to the electrical equipment innovations. The rise of composites enables the insulating material to be endowed with more functions. By this concern, adopting the coupling agents is one of the effective methods to improve the compatibility of composites, which highly strengthens the desired properties. The functional groups of coupling agents, nevertheless, could not always show a positive impact to access enhanced properties. In this work, four types of silane coupling agents including amino-propyl (AP), glycidyletheroxy-propyl (GP), vinyl (V), and methacryloxy-propyl (MP) functional groups are employed to modify the AlN fillers, and the modification effects on the insulating and thermal conductivity of the AlN/Poly(m-phenylenedicarbonyl-m-phenylenediamine) (PMIA) composite paper are systematically investigated and compared. The results show that a proper coupling agent is beneficial to the uniform dispersion of the inorganic filler in the organic matrix and highly contributes to their interface quality, where the heat transfer path is established that boosts the heat dissipation. By tailoring the trap depth and density towards deeper and higher, the carrier transport is highly confined which enhances the breakdown strength to a large extent. Therefore, high breakdown strength and thermal conductivity of 182.9 kV/mm and 0.302 W/(m·K), respectively, are achieved in the GP modified AlN/PMIA paper, which are 16.7% and 167.4% higher than that of pure PMIA paper.

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Section: Introductionmentioning

confidence: 99%

High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent

Yang

Ruan

Fan

et al. 2023

J. Phys. D: Appl. Phys.

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Tuning Interfacial Characteristics of Epoxy Composites Towards Simultaneous High Thermal and Dielectric Properties

Zhong,

Feng,

Zhou

et al. 2024

Macro Chemistry & Physics

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Achieving excellent thermal and dielectric performance is crucial to prevent premature insulation failure of epoxy in high‐frequency transformers. However, interfaces introduced by embedding micro/nano fillers in epoxy have opposite effects on these properties. Here, the interfacial characteristics of micro‐BN/nano‐Al2O3 epoxy is tailored composites by modifying nano‐Al2O3 with functional amine groups, leading to simultaneous improvements in thermal conductivity and high‐frequency breakdown strength. After modification, thermal conductivity increased from 0.193 to 0.490 W m−1 K−1 at 25 °C, and breakdown strength improved from 85.4 to 94.8 kV mm−1 at 10 kHz. The findings revealed the coexistence of overlapping interfaces between micro‐BN and chemical interfaces between modified Al2O3‐NH2 and matrix in composites. Contrary to the overlapping interface, the chemical interface played a more pivotal role in macroscopic performance. Calculations based on a covalent bonding interfacial model demonstrated that this in‐situ tight interface facilitated phonon transport, thereby enhancing thermal conductivity. Besides the physical structure, an increase in electrostatic potential in the chemical interface also impeded charge migration, resulting in an improved breakdown strength. The synergistic effect of the chemical interface on thermal and dielectric properties presents a promising design strategy for developing high‐performance epoxy composites.

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Enhanced high‐temperature electrical properties and charge dynamics of inorganic/organic silicone elastomer nanocomposites via nanostructure grafting and molecular trap construction

Wang,

Tanaka,

Miyake

et al. 2024

Polymer Composites

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This study introduces a novel strategy to enhance the high‐temperature electrical performance of the silicone elastomer (SE), while ensuring control over its thermal and mechanical properties for SiC device packaging insulation application. For the same, the ultra‐low‐content inorganic/organic SE nanocomposites are prepared and tested (at room temperature and 150°C) by grafting polyhedral oligomeric silsesquioxane (POSS) nanofillers and doping organic semiconductors. It is found that grafting POSS nanofillers enhances the SE's thermal and mechanical properties. Moreover, doping the grafted SE with different organic semiconductors (ITIC, PCBM, and NTCDA) further improves its electrical properties and charge dynamics at 150°C. The optimal doping content for ITIC, PCBM, and NTCDA is found to be 0.05, 0.10, and 0.15 wt%, respectively. Among these, NTCDA exhibits superior electrical performance at 150°C. Particularly, compared to pure SE, NTCDA doping and POSS grafting reduce the electrical conductivity by an order of magnitude and increase the breakdown strength, charge hopping activation energy, and trap energy level by 65.5%, 0.20 eV and 0.73 eV, respectively. This study finds that organic semiconductors outperform nanostructures in inhibiting electron injection and immobilizing free electrons at high temperatures.Highlights Nano‐POSS grafting enhances material properties by reinforced molecular chains. Charge dynamics is studied by space charge and current integrated charge at HT. Organic semiconductors improve electrical properties and charge dynamics at HT. Organic semiconductors outperform nanofillers in immobilizing electrons at HT. The ideal organic semiconductor doping level correlates with its energy gap.

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Effect of POSS on the Dielectric Properties of Thermally Aged Epoxy Resin Insulating Materials

Cited by 9 publications

References 0 publications

High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent

High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent

Tuning Interfacial Characteristics of Epoxy Composites Towards Simultaneous High Thermal and Dielectric Properties

Enhanced high‐temperature electrical properties and charge dynamics of inorganic/organic silicone elastomer nanocomposites via nanostructure grafting and molecular trap construction

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