2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024
DOI: 10.1109/eurosime60745.2024.10491410
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Effect of potting on the solder joint reliability of QFN packages under thermal cycling load

Chinmay Nawghane,
Bart Vandevelde,
Daniel Vanderstraeten
et al.
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