Effect of process parameters on the residual stresses and the wear behavior of aluminum nitride physical vapor deposition coatings

Kleer, G.; Kassner, R.; Meyer, Eva-Maria; Schinker, M. G.; Doell, W.

doi:10.1016/s0257-8972(09)90045-7

Cited by 14 publications

(7 citation statements)

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“…The observed change from tensile to compressive stresses for the coatings deposited in the RF magnetron process, can be related to results known from the literature where influences of the total pressure on the residual stresses of transition-metal coatings [6] and AlN coatings [7] were evaluated. As the energy of the particles involved in the process is the main parameter influencing the microstructure, and therefore the intrinsic stress of a sputtered coating, tensile stresses observed at high pressures can be attributed to losses of energy through collisions with gas particles during the process.…”

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confidence: 76%

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Effects of Elevated Temperatures and Oxidation on Residual Stresses in (Ti,Al)N Coatings

Schäffer

Kleer²

2000

Adv. Eng. Mater.

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confidence: 76%

“…[7] These techniques are usually characterized as high' or low' activity processes. The high-activity process results in very high concentrations of aluminum at the coating surface and necessitates an additional post-coating heat treatment.…”

mentioning

confidence: 99%

Effects of Elevated Temperatures and Oxidation on Residual Stresses in (Ti,Al)N Coatings

Schäffer

Kleer²

2000

Adv. Eng. Mater.

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“…This is because AlN exhibits the desired combination of characteristics such as high thermal conductivity (320 W/mK), good corrosion resistance, high hardness, high electrical resistivity and high wear resistance . In this regards various methods have been developed for the formation of aluminum nitride including physical vapor deposition (PVD), chemical vapor deposition (CVD), glow discharge,, magnetron sputtering,, active screen plasma treatment and ion‐implantation…”

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confidence: 99%

Enhancement of Mechanical and Structural Traits of Aluminum Using Low Energy Plasma Focus Device

et al. 2019

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Owing to good machinability, low weight and high specific strength, aluminum is widely used in aerospace and automotive industries. However, low mechanical strength limits its wide spread use in mainstream industries. In this study, nitriding of aluminum was performed with a stream of low energy ions in 1.8 kJ Mather type dense plasma focus (DPF) device. The axial distance from the anode tip was varied in steps to study the effect of the stream length on structural and mechanical properties of the nitrided samples. XRD and Raman analysis confirmed the formation of aluminum nitride (AlN) on the plasma exposed surface. Williamson‐Hall (W−H) study revealed significant improvement in crystallinity and strain of the nitride samples. The most favorable results on mechanical and structural properties of the nitrided samples were obtained at an axial distance of 10 cm. The improved texture and maximum dislocation density for typical AlN (311) is obtained at the optimum distance. The micro‐hardness of the nitrided samples was measured ∼4.5 times higher than the base material.

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“…The extensive literature on AlN deposition by physical vapour deposition (PVD) processes [1][2][3][4][5][6][7][9][10][11][12][13][14][15][16][17] highlights the importance of this material. Owing to its good dielectric properties, high thermal conductivity and thermal expansion coefficient similar to that of Si, most development work on electronic and applications is somehow downsizing its remarkable hardness, high temperature stability, and strength which render this material as a very promising coating for tribological applications.…”

Section: Introductionmentioning

confidence: 99%

Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition

Figueroa

Salas

Oseguera

2006

Surface Engineering

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The relationship of processing, microstructure and properties during deposition of AlN layers on glass substrates by reactive magnetron sputtering was investigated. The AlN films were prepared with two working gas mixtures: 3 : 1 and 1 : 1 Ar/N 2 volume ratios; three working pressure values: 0 . 2, 0 . 5 and 0 . 8 Pa and two target to substrate distances: 2 . 5 and 3 cm. The resulting films were analysed by scanning electron microscopy and energy dispersive X-ray microanalysis and X-ray diffractometry. In the ranges of processing variables studied, film growth morphology and orientation were mainly affected by working pressure, where deviations from expected behaviour were attributed to process instabilities. No significant influence of gas mixture composition or substrate to target distance was detected in the ranges studied. The effect of pressure was rationalised in terms of the associated energy of the Ar ion film bombardment, which was expected to cause only surface film modifications owing to its low estimated values, but enough to produce structural changes. The development of residual stresses and their effect on hardness and fracture behaviour of the films were mostly influenced by the type of columnar growth and film thickness.

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Effect of process parameters on the residual stresses and the wear behavior of aluminum nitride physical vapor deposition coatings

Cited by 14 publications

References 5 publications

Effects of Elevated Temperatures and Oxidation on Residual Stresses in (Ti,Al)N Coatings

Effects of Elevated Temperatures and Oxidation on Residual Stresses in (Ti,Al)N Coatings

Enhancement of Mechanical and Structural Traits of Aluminum Using Low Energy Plasma Focus Device

Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition

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