Effect of pulsing parameters on laser ablative cleaning of copper oxides

Abstract

Articles you may be interested inAnalysis of the structure, configuration, and sizing of Cu and Cu oxide nanoparticles generated by fs laser ablation of solid target in liquidsThe characteristics of copper oxide removal are comparably investigated under different pulsing strategies. A two-dimensional model is utilized to numerically simulate the laser ablative cleaning process. In the model, property discontinuity and Stephan and kinetic boundary conditions are taken into account, and the moving phase interface in the material is evaluated with the enthalpy method. Experiments are carried out on copper samples having different oxide layer thicknesses. The copper oxide layer thicknesses determined by ellipsometer and the chemical constituents of the copper oxide layer determined via x-ray photoelectron spectroscopy are incorporated into this numerical model. Under the single-pulse irradiation strategy, a higher laser intensity threshold is determined by the model based on the criterion of removing the oxide film as much as possible without damaging the substrate. Under the multipulse irradiation strategy, a lower threshold is employed to remove the oxide layer, while the appropriate pulse numbers under different laser intensities and different laser pulse repetition rates are the key issues investigated. A reasonable agreement is obtained between the experimental and simulated results.

Intracellular Biosynthesis and Removal of Copper Nanoparticles by Dead Biomass of Yeast Isolated from the Wastewater of a Mine in the Brazilian Amazonia

“…The Cu 2p core level showed a sharp peak arise at 932,9 eV and it corresponds to the Cu 2p 3/2 level characteristic of Cu(0) [53], [54], [55]. The presence of CuO (Cu (II)) phase can be excluded considering the lacking of the signal at 933.7 eV, as well as the presence of Cu 2 O, that can be is ruled out by the fact of no Cu 2p satellite peak appears with Cu 2 O [56]–[57].There are several reports in literature of yeast mediating the synthesis of nanoparticles of metal ions except to copper such as, peptide-bound CdS quantum crystallites by Candida glubrata [58], Schizosaccharomyces pombe also produced CdS nanoparticles [59], PbS nanocrystallites by Torulopsis sp. [60], gold nanoparticles by Pichia jadinii ( Candida utilis ) [61]–[62], the tropical marine yeast Yarrowia lipolytica NCIM 3589 also synthesized gold nanoparticles [63], Sb 2 O 3 nanoparticles by Saccharomyces cerevisiae [64] and silver nanoparticles by yeast MKY3 [65].…”

- Biodegradability of Oily Wastewater Using Rotating Biological Contactor Combined with an External Membrane

“…The Cu 2p core level showed a sharp peak arise at 932,9 eV and it corresponds to the Cu 2p 3/2 level characteristic of Cu(0) [53,54,55]. The presence of CuO (Cu (II)) phase can be excluded considering the lacking of the signal at 933.7 eV, as well as the presence of Cu 2 O, that can be is ruled out by the fact of no Cu 2p satellite peak appears with Cu 2 O [56][57].There are several reports in literature of yeast mediating the synthesis of nanoparticles of metal ions except to copper such as, peptide-bound CdS quantum crystallites by Candida glubrata [58], Schizosaccharomyces pombe also produced CdS nanoparticles [59], PbS nanocrystallites by Torulopsis sp. [60], gold nanoparticles by Pichia jadinii (Candida utilis) [61][62], the tropical marine yeast Yarrowia lipolytica NCIM 3589 also synthesized gold nanoparticles [63], Sb 2 O 3 nanoparticles by Saccharomyces cerevisiae [64] and silver nanoparticles by yeast MKY3 [65].…”

Micro‐Laser Processing

“…Laser-based material processing on a microscale has been used in thermal processing, shock peening, surface treatment, cleaning of surfaces, welding, melting and polishing, scribing, as well as micromachining of basic geometric features on a variety of materials [1][2][3][4][5][6][7][8][9][10][11][12].…”

“…The main laser parameters to be chosen and controlled are wavelength, λ (nm); average power (W) or energy (J); intensity (W/m 2 ) or fluence, ( ) (J/m 2 ); pulse duration, τ (s); pulse repetition rates (Hz); and peak power (pulse energy/pulse duration) [9,11,16,20,21].…”

“…Laser-based material processing on a microscale has been used in thermal processing, shock peening, surface treatment, cleaning of surfaces, welding, melting and polishing, scribing, as well as micromachining of basic geometric features on a variety of materials [1][2][3][4][5][6][7][8][9][10][11][12].Lasers are usually categorized as two groups: continuous wave (cw) and pulsed lasers. Conventional cw and pulsed laser irradiation and ablation is used in many fields, such as material processing, machining, etching, deposition, sintering, micro-fluidics, medical, and many other applications [13][14][15][16][17][18][19].…”