Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder

Abstract

Cerium-lanthanum mixed rare earth (RE) (0.5 wt.%) was added to Zn-20Sn high-temperature lead-free solder to study the effect of RE on the solder properties. The Zn-20Sn-0.5RE solder has a better corrosion resistance than that of Zn-20Sn alloy. RE addition increases the c-Cu 5 Zn 8 layer thickness, promotes growth of a e-CuZn 5 layer shaped like bamboo shoots, and increases the roughness of the e-CuZn 5 layer, which increases the shear strength of the solder joints. Compared with the Zn-20Sn alloy, the creep resistance of the Zn-20Sn-0.5RE solder was improved after soldering. The indentation hardness increases in an order of Zn-20Sn-0.5RE solder, Zn-20Sn solder, e-CuZn 5 layer, and c-Cu 5 Zn 8 layer.

Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process

“…The use of this type of solder has been limited in recent years due to the environmental risks of lead toxicity as well as other health concerns. [1][2][3] Various studies have attempted to introduce a proper alternative for the Sn-Pb alloy for soldering applications. For this end, various lead-free solder alloys have been proposed with various elements such as Ag, Mg, In, Cu, Zn, Bi, Ni and Sb.…”

“…For this end, various lead-free solder alloys have been proposed with various elements such as Ag, Mg, In, Cu, Zn, Bi, Ni and Sb. 1,[4][5][6][7][8] The microstructures, mechanical properties, wettability and melting point of these solders have been studied by various researchers. 9 Today, Sn-Cu, Sn-Ag and Sn-Ag-Cu are amongst the foremost lead-free solders.…”