Effect of rare element cerium on the morphology and corrosion resistance of electro-less Ni-P coatings

Chuan-qi, FU; Ye, Fan; Wang, Siyuan; Wang, Zhou; Zhang, Qingle; Luo, Xuliang

doi:10.1051/matecconf/20153501008

Cited by 1 publication

(6 citation statements)

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“…However, the excessive addition of cerium salt could have degraded the homogeneity of the film, which resulted in the decrease of the hardness and the adhesive force of the film. This is in agreement with the results of some of the literature [16,17].…”

Section: Composition and Microstructure Of The Pd-ni Filmsupporting

confidence: 93%

“…Table 3 shows the crystallite sizes of the Pd alloy films, as calculated by Scherrer equation. It can be seen that the crystallite size of the Pd-Ni film was reduced after CeCl 3 addition, indicating that the addition of CeCl 3 apparently decreased the crystallite size and refined the microstructure of the Pd-Ni film, which is in agreement with the results in the literature [16,17].…”

Section: Composition and Microstructure Of The Pd-ni Filmsupporting

confidence: 91%

“…Therefore, it was more difficult for H + to be reduced, and the reaction rate of hydrogen evolution thereby decreased, so the occurrence of pinholes in the film was inhibited to some degree [20]. The trend of the porosity with the variation of the cerium salt concentration was similar to that in the literature [16]. Table 4.…”

Section: Porosity Of the Pd-ni Alloy Filmssupporting

confidence: 79%

“…It can be noted that the adhesive strength and hardness of the Pd-Ni film had the same variation tendency with the concentration of CeCl 3 in the plating solution. This was probably because that the addition of cerium salt could refine the film's grain size, reduce the film's pinholes during deposition, and make the surface of the film more compact and uniform [16,17]. These would have resulted in an enhanced bonding force [16] .…”

Section: Composition and Microstructure Of The Pd-ni Filmmentioning

confidence: 99%

“…This was probably because that the addition of cerium salt could refine the film's grain size, reduce the film's pinholes during deposition, and make the surface of the film more compact and uniform [16,17]. These would have resulted in an enhanced bonding force [16] . Meanwhile, according to the Hall-Petch relationship, the micro-hardness of the film was also improved as the result of the grain refinement [18,19].…”

Section: Composition and Microstructure Of The Pd-ni Filmmentioning

confidence: 99%

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The Improvement of Hardness and Corrosion Resistance of Electroplated Pd-Ni Film on 316L Stainless Steel by CeCl3

Wang

Zuo

et al. 2020

Coatings

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By using the methods of XRD, SEM/EDS, electrochemical polarization, and a weight loss test, the effects of the rare earth salt CeCl 3 on the adherence, hardness, porosity and corrosion resistance of an electroplated Pd-Ni film on 316L stainless steel were studied. The results showed that by adding 1.0 g L −1 CeCl 3 in the plating bath, the obtained Pd-Ni film was obviously improved. The grain size was refined, and the microstructure was more compact and uniform. The film hardness and the adherence to the substrate increased, and the corrosion resistance in a 20 wt % H 2 SO 4 solution (80 • C) obviously increased. Ce 3+ increased the throwing power of the bath, which resulted in more uniform current distribution and strengthened the cathodic polarization degree during the electroplating process.The rare earths have been used in many fields such as electroplating, surface conversion coating, heat treatment, metal corrosion protection, and friction resistance, which makes them good prospects for applications [1-6] due to their unique electronic structures and chemical activity. Electroplating is a traditional surface protection technology. In the electroplating process, adding a small amount of soluble rare earth salt in the plating bath can improve the properties of the coatings, such as some physical properties and corrosion resistance [1,3,4] In addition, a rare earth salt can improve the throwing power (T.P.) of the plating solution, reduce the grain size of the plating alloy, and make the microstructure of the coating more uniform [7-9]. The T.P. is a measure of an electroplating solution's ability to plate a uniform film over an irregularly shaped cathode, which can be evaluated by using a Haring-Blum rectangular cell. Under the same plating conditions, the larger the T.P. value, the stronger throwing power of the electroplating solution and the more uniform the film formed on the surface of the substrate [9].The palladium film has excellent corrosion resistance, abrasive resistance, electrical conductivity, catalytic properties, hydrogen evolution performance, and a white appearance, all of which have led to its use as good hydrogen storage and catalytic materials. It has also been widely used in the electronics industry, in applications such as semiconductors and printed circuit boards, and the decorative industry [10,11]. In our previous study, Pd film plating on stainless steel was shown to greatly improve corrosion resistance in strong reductive corrosive environments, such as a hot, diluted sulfuric solution, by effectively improving the passive ability of the steel [12]. Pd-Ni and Pd-Cu alloy coatings with good surface micro-hardness and adhesive strength were deposited on 316L stainless steel by electroplating, and these coatings showed very good corrosion resistance in a hot sulfuric acid solution and an acetic

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Section: Composition and Microstructure Of The Pd-ni Filmsupporting

confidence: 93%

Section: Composition and Microstructure Of The Pd-ni Filmsupporting

confidence: 91%