2015
DOI: 10.1179/0020296714z.000000000194
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Effect of saccharin and thiourea on electrodeposition of cobalt and characteristics of deposits

Abstract: Cobalt electrodeposits have been produced from two types of baths. In the bath containing cobalt sulphate, cobalt chloride and boric acid, saccharin is found effective as a brightener additive. In the bath containing cobalt sulphate, potassium chloride and potassium citrate, thiourea is found to be effective as a brightener additive. Results of solution characteristics such as conductivity of the electrolytes, cathode current efficiency and rate of deposition are compared. The effect of additives on brightness… Show more

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Cited by 9 publications
(4 citation statements)
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“…This particular Furthermore, the primary reason for the change in corrosion resistance can be attributed to the elimination of defects on the coating surface facilitated by the addition of saccharin. The additives in the coating served as a physical barrier by filling cracks and micron-sized gaps, partially obstructing reactive areas and reducing cathodic reactions [13].…”
Section: Corrosion Analysesmentioning
confidence: 99%
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“…This particular Furthermore, the primary reason for the change in corrosion resistance can be attributed to the elimination of defects on the coating surface facilitated by the addition of saccharin. The additives in the coating served as a physical barrier by filling cracks and micron-sized gaps, partially obstructing reactive areas and reducing cathodic reactions [13].…”
Section: Corrosion Analysesmentioning
confidence: 99%
“…However, an excess of sulphur led to negative corrosion results. Additionally, the coatings' active area decreased as a result of the addition of saccharin [13].…”
Section: Corrosion Analysesmentioning
confidence: 99%
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“…Therefore, previous researches on cobalt electrodeposition mainly focused on the cobalt structure, shape control, and deposition mechanism for the cobalt film on the plane substrate. [12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28] In contrast, in patterned areas such as interconnects, the purpose of the study is completely different, and research on the electrodeposition for feature filling using cobalt is insufficient.…”
mentioning
confidence: 99%