Effect of sample perimeter and temperature on Sn–Zn based lead-free solders

The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate

“…The first layer is a mixture of Cu-Sn + Cu-Zn and the morphology is scallop type and the second layer close to the Cu substrate is a flat ␥-Cu 5 Zn 8 phase. The similar results have been reported elsewhere [14]. Bi does not take part in the interfacial reaction and not form any IMCs with Cu [16].…”

“…In our previous study [14], wetting balance was used to study the wetting properties of the Sn-Zn solders. The present study has focused on tensile tests carried out on the Cu/Sn-9Zn/Cu and Cu/Sn-8Zn-3Bi/Cu joints strength at different crosshead speed.…”

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

“…The extra element(s) includes Bi [21][22][23], Ag [24][25][26], In-Ag [27,28], Ag-Cu [29] and Ag-Al-Ga [30].…”

Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples

“…Extensive investigations have been ongoing over the last few years to find acceptable and suitable Pb-free solders to replace Sn-Pb solders in the electronic packaging industry. For economic reasons, the Sn-9 wt%Zn alloy has become a highly recommended candidate for lead-free solders because of its lower liquidus temperature [1][2][3][4][5].…”