Effect of sandblasting defects distribution on the mechanical strength of a soda-lime glass

Effect of nano aluminum nitride filler on mechanical, thermal, and dielectric properties of the glass/mullite composites for low‐temperature co‐fired ceramic applications

“…The properties were determined using assintered samples. The flexural strength values of mullite, soda-lime glass and AlN are 182 MPa 26 and 87 MPa, 32 and 300-350 MPa, 17 respectively. The flexural strength was 92 F I G U R E 5 Young's modulus and flexural strength of the composites sintered at optimum sintering temperature for each composition.…”

“…The properties were determined using as‐sintered samples. The flexural strength values of mullite, soda‐lime glass and AlN are 182 MPa 26 and 87 MPa, 32 and 300–350 MPa, 17 respectively. The flexural strength was 92 (±19) MPa for the M55, 111 (± 24) MPa for the M55‐1, 101 (± 17) MPa for the M55‐2.5, 97 (± 17) MPa for the M‐55‐5 and 88 (±11) MPa for the M55‐10.…”

Mechanical, thermal, and dielectric properties of glass mullite composites for low‐temperature cofired ceramic and radome applications

“…22 It was also reported for the SiO 2 -B 2 O 3 -CaO-MgO glass/Al 2 O 3 composites that k decreased with increasing glass content from 3.56 W/m⋅K (50 wt% glass) to 3.20 W/m⋅K (60 wt% glass). 41 Although crystalline phases such as mullite and in situ crystallized anorthite were present in the structure, these phases were embraced by an amorphous phase that reduced the overall thermal conductivity of the composites. 44 An increasing glass content decreased the CTE to 4.61 ppm/ • C for the M10, 4.27 ppm/ • C for the M20, and 4.25 ppm/ • C for the M30.…”

“…31 Note that mullite and glass are end members given to compare the properties of the composites. Glass-ceramic composites are used for the LTCC applications that require densification at temperatures lower than 950 • C to allow cofiring with metal electrodes (e.g., silver melts at 961 • C 52 ), a CTE matching to Si chips for reliability, higher thermal conductivity to remove heat from the circuit, and lower 3.06 [23] 7.4 [23] 0.0031 [23] 6.07 [47] 5.26 [23] -142 [23] 1070-1120 [23] 185 [23] 182 2.43 [22] 6.37 [22] 0.0016 [22] 0.85 [48] 0.55 [25] --591 ± 33 [22] 70 [42] 87 [41] dielectric constant (loss) to increase signal transmission speed (to reduce heat loss). 9 Low thermal conductivity is one of the main disadvantages of the LTCC systems due to the poor thermal conductivity of the glass phase.…”

“…The composites were prepared at dimensions of 3 × 4 × 50 mm 3 to determine both flexural strength and elastic modulus using as‐sintered surfaces. The flexural strength values of mullite and soda‐lime glass are 182 MPa 23 and 87 MPa, 41 respectively. The flexural strength of the composites first slightly decreased from 182 MPa (mullite) to 180 MPa (M10) and then sharply decreased to 112 MPa (M30), and then remained almost the same (e.g., 95 MPa for the M50 to 89 MPa for the M60) due to viscous sintering.…”