Effect of Sb and Zn Addition on the Microstructures and Tensile Properties of Sn–Bi-Based Alloys

Abstract

The tensile behavior of Sn–Bi–Cu and Sn–Bi–Ni alloys has been widely investigated. Reportedly, the addition of small amounts of a third element can refine the microstructures of the eutectic Sn-58mass% Bi solder and improve its ductility. However, the superplasticity mechanism of Sn-based alloys has not been clearly established. Therefore, in this study, the effects of Sb and Zn addition on the microstructures and tensile properties of Sn–Bi-based alloys were investigated. The alloys were subjected to tensile tests under various strain rates and temperatures. We found that Zn- and Sb-added Sn–Bi-based alloys demonstrated superplastic deformation at high temperatures and low strain rates. Sb addition significantly affected the elongation of the Sn–Bi–Sb alloys because the metal dissolves in both the primary Sn phase and the eutectic Sn–Bi matrix. The segregation of Zn and formation of needle-like Zn particles at the eutectic Sn–Bi phase boundary affected the superplastic deformation of the alloys. The deformation of the Sn–40Bi-based alloys at high temperatures and low strain rates led to dynamic recovery, dynamic recrystallization, and/or grain boundary slip because of the accumulation of voids.

Advances of liquid metal hydrogel composites in biomedical applications

“…These metals include indium (In, mp: 156.6 • C), tin (Sn, mp: 231.9 • C), and bismuth (Bi, mp: 271.4 • C), all of which melt below 330 • C. Currently, the most commonly used Ga-based LM alloys are eutectic galliumindium alloys (EGaIn, 75% Ga and 25% In by weight, mp: 15.5 • C) and gallium-indium-tin alloys (typically, Galinstan, 68% Ga, 22% In and 10% Sn by weight, mp: 10 • C) [45]. Additionally, some Bi-based alloys can regulate their physical properties by adding different metals, such as the melting point [46,47]. In this review, the term LMs specifically refers to metal Ga and Ga-based LM alloys unless otherwise specified.…”

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

“…Rodney, for instance, incorporated 0 to 8 wt.% Sb into Sn, generating whisker-like SbSn precipitates and thereby reducing the creep rate of a Sn solder at 150 • C [11]. Furthermore, Sb could refine the microstructure of Sn-based solders [12,13]. Adding Sb to a SnBi solder improved the shear strength and creep resistance of solder joints [14][15][16].…”

Understanding the surface segregation of solute atoms in Sn-Bi–based solder from first principles

“…The incorporation of alloying elements with minor amounts in Sn-Bi solders could refine the microstructure and improve their mechanical strength [17][18][19][20][21][22][23][24][25][26][27][28][29]. The Sn-Bi-Ag ternary alloys were fabricated and the Bi-rich phase was remarkably refined and uniformly dispersed in the matrix with the addition of 1.0 wt% Ag [19].…”

“…Yang et al [23] reported that doping with Ni could effectively inhibit the growth of IMC layer between the Sn-Bi solder and the Cu substrate, maintaining the strength of the solder as a result. The effects of other elements such as Sb, In, Zn on the Bi-rich phase formation were investigated [24][25][26][27][28][29]. The results show that the Bi coarsening has been eliminated and the microstructure has been refined with a certain amount of these elements.…”