Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics

Ladani, Leila; Dasgupta, Abhijit; Cardoso, Idélcio Alexandre Palheta; Monlevade, Eduardo Franco de

doi:10.1109/tepm.2007.914222

Cited by 24 publications

(11 citation statements)

References 14 publications

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“…Solder paste printing is commonly used for attaching surface mount device to printed circuit boards (PCBs). It has been reported that a majority of the problems associated with PCB assembly can be traced back to the solder paste printing process (Ladani et al , 2008; Amalu et al , 2011; Wang, 2013; Huang et al , 2016). It is also recognized that the solder paste printing process has a dramatic impact on the productivity and quality of surface mount assembly line (Sriperumbudur et al , 2017).…”

Section: Introductionmentioning

confidence: 99%

A method for optimizing stencil cleaning time in solder paste printing process

Cao

et al. 2019

SSMT

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Purpose Stencil cleaning is an important operation in solder paste printing process. Frequent cleaning may interrupt printing process and increase idle time, as well as loss for performing cleaning. This paper aims to propose a method to optimize the stencil cleaning time and reduce unnecessary cleaning operations and losses. Design/methodology/approach This paper uses a discrete-time, discrete-state homogeneous Markov chain to model the stencil printing performance degradation process, and the quality loss during the stencil printing process is estimated based on this degradation model. A stencil cleaning decision model based on renewal reward theorem is established, and the optimal cleaning time is obtained through a balance between quality loss and the loss on idle time. Findings A stencil cleaning decision model for solder paste printing is established, and numerical simulation results show that there exists an optimal stencil cleaning time which minimizes the long-term loss. Originality/value Stencil cleaning control is very important for solder paste printing. However, there are very few studies focusing on stencil cleaning control. This research contributes to developing a model to optimize the stencil cleaning time in solder paste printing process.

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Section: Introductionmentioning

confidence: 99%

A method for optimizing stencil cleaning time in solder paste printing process

Cao

et al. 2019

SSMT

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“…Previous researchers reported that printing quality performance is greatly influenced by different solder paste materials, PWB designs, stencil aperture designs, and printing process parameters [ 9 , 10 , 11 ]. Other factors investigated by Pan et al [ 12 ] are related to the effect of stencil thickness, solder type, aperture size, aperture shape, and print speed.…”

Section: Introductionmentioning

confidence: 99%

“…They studied the parameters of the printing process, including solder paste printing, component placement, stencils, PWB land pattern designs, and reflow soldering processes. A systematic approach in the solder printing process was introduced by Ladani et al [ 11 ], who investigated the effect of stencil thickness and waiting time before printing, on the creation of the defect. Based on the discussions of prior researchers, we identified the effect of some parameters on the quality of PWBs.…”

Section: Introductionmentioning

confidence: 99%

Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

et al. 2014

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The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s).

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“…This is different from the traditional thermomechanical fatigue problem, since the loading rate involved in drop and impact can be several orders of magnitude higher than that during thermal cycling. An additional concern is for the tin (Sn)-based lead (Pb)-free solders [14][15][16][17][18][19][20] being used and/or developed as environment-friendly replacements of the conventional Pb-bearing solder. Since the Pb-free solder alloys are generally more brittle compared to the conventional Sn-Pb eutectic, they may be more susceptible to failure caused by dynamic loading.…”

Section: Introductionmentioning

confidence: 99%