Effect of SiC formation temperature on improvement in thermal conductivity of electrodeposited SiC-coated diamond/Cu composite plating

Investigation of Cu-diamond/Cu-diamond-high-entropy alloys bi-layer coating via mechanical alloying

“…The annealed pure copper sample is noted as T2-500. The TC (λ, W/m/K) of samples (including the substrate and the coating) before and after annealing were calculated separately by the following equation 7 : where α, C P and ρ represent the thermal diffusivity (m 2 /s), heat capacity (J/g/K) and density (g/m 3 ), respectively. Density (ρ) obtained through drainage method.…”

“…6 In contrast, Cu as a matrix is the most widely used pure metal and diamond/Cu composites have become a focal point for new thermal management materials due to theoretically satisfactory TC and CTE. 7 However, the low hardness, strength and wear resistance greatly limit their applications and the high CTE of Cu seems to be incompatible with chip materials. [8][9][10] In this context, the excellent mechanical properties and low CTE of highentropy alloys (HEA) at room temperature offer the opportunity to broaden the choice of substrates.…”

Preliminary Study on Electrodeposition of Copper Platings and Codeposition of Carbon Nanotubes from Organic Solvent

“…Electrodeposition of metal platings accompanied by the codeposition of carbon materials, namely metal/carbon composite platings, has garnered reputation as a promising method for enhancing the properties or imparting additional functions to conventional metal platings [1,2]. In particular, the codeposition of carbon materials has been found to be an effective strategy for improving corrosion resistance [2][3][4], electrical conductivity [4,5], thermal conductivity [6][7][8], abrasion resistance [8,9], hardness [8][9][10], etc. Numerous carbon materials, including carbon black [11], carbon fibers [12,13], single-or multi-walled carbon nanotubes (CNTs) [2,4,5,9,10,14], graphene and its derivatives [3,8,15,16], and diamonds [6,7,[17][18][19] have been considered as filler materials for composite platings.…”

“…In particular, the codeposition of carbon materials has been found to be an effective strategy for improving corrosion resistance [2][3][4], electrical conductivity [4,5], thermal conductivity [6][7][8], abrasion resistance [8,9], hardness [8][9][10], etc. Numerous carbon materials, including carbon black [11], carbon fibers [12,13], single-or multi-walled carbon nanotubes (CNTs) [2,4,5,9,10,14], graphene and its derivatives [3,8,15,16], and diamonds [6,7,[17][18][19] have been considered as filler materials for composite platings. Although several carbon filler materials are in use, an appropriate carbon material should be chosen according to the desired performance of the plating and environment where it will be used [2].…”