Effect of SiC nanoparticles on SAC305-TSV reliability under thermal load

Impact of pre-torsional deformation and nanoparticles addition on the mechanical behavior of Sn-based soft solder alloy

“…Many researchers chose rare earth, Ge, Ni, Ga, Co, and In. Furthermore, a novel way was used to improve solder properties by the addition of nano-oxide materials such as Al 2 O 3 , ZnO and SiC that acts as pinners for grain boundary migration [4,5,13,14]. The addition of the fourth elements; Fe, Ti,Co, Mn, and Ni on the microstructure and mechanical properties of Sn-Ag-Cu solder was studied by Kim and co-workers [15].…”