2013
DOI: 10.7763/ijmmm.2013.v1.60
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Effect of Sintering Parameters on Microstructure and Properties of Mechanically Alloyed Copper-Tungsten Carbide Composite

Abstract: Abstract-In this study, copper-tungsten carbide composite was produced by mechanical alloying and powder metallurgy. The effect sintering temperature and time (800°C to 1000°C and 1 to 3 h) on composite microstructure and properties were investigated. The results showed that WC is formed at lower temperature and the presence of WC favoured the enhancement of the properties of the composite. The increased both hardness and electrical conductivity has been observed with the increase sintering temperature. Index … Show more

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Cited by 12 publications
(12 citation statements)
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“…It is noted that the first sample that does not contain graphite is higher in density than the rest of the samples, and the sintering density has limits of 8.64g/cm 3 . The possible reason for this is the sintering temperature, which reduced the porosity and caused a high-density structure consistent with Yusoff et al (2013), where the measured density value at sinter temperature 950ºC was 8.2g/cm 3 .…”
Section: Density Of Sinteringsupporting
confidence: 57%
See 1 more Smart Citation
“…It is noted that the first sample that does not contain graphite is higher in density than the rest of the samples, and the sintering density has limits of 8.64g/cm 3 . The possible reason for this is the sintering temperature, which reduced the porosity and caused a high-density structure consistent with Yusoff et al (2013), where the measured density value at sinter temperature 950ºC was 8.2g/cm 3 .…”
Section: Density Of Sinteringsupporting
confidence: 57%
“…After pressing, sintering was performed at 930° C for two hours. The researchers found (Yusoff et al 2013) that the suitable sintering temperature for copper sintering materials supported by tungsten carbide ranges from 850° C to 950° C for two hours.…”
Section: Composites Preparationmentioning
confidence: 99%
“…Regardless of the good electrical and thermal properties of copper, it suffers from high coefficient of thermal expansion and low mechanical properties, which decreases the lifespan of its component. 15…”
Section: Introductionmentioning
confidence: 99%
“…After milling, high temperature sintering activates thermal diffusion of atoms resulting into recombination of nano‐sized crystallites giving rise to bigger crystallites. As crystallites become bigger in size, stress relaxation takes place, consequently decrease in lattice strain is observed after heat treatment …”
Section: Resultsmentioning
confidence: 99%