In the scenario of fifth-generation communication, especially
millimeter
wave (mmW) transmission, microelectronic material is required to have
better signal stability, that is, a lower dielectric constant (Dk
) and dielectric loss (Df
). This work takes full advantage of the low dielectric
molecular structure characteristics in polyphenylene sulfide (PPS)
and the nonresidual low dielectric characteristics of supercritical
CO2 (scCO2) foaming to enhance the low dielectric
performance. The distinct structure of a highly stable thioether bond
and highly reactive hydrogen in the benzene ring in the PPS macromolecule
enables the oxo-bridging between PPS molecular chains and hence increases
PPS melt strength. By further adjusting the regularity in PPS molecular
chains to broaden the melting range of PPS crystals, the PPS microcellular
foam of large expansion ratio (16.5-fold) with uniform cells is obtained.
It has an ultralow Dk
of 1.14 and Df
of 0.0005 at 3 GHz. In the Ka band of 26–40 GHz, the broadband signal transmission has
nearly no loss (∼99%). Furthermore, it has a low density (<0.08
g/cm3), is hydrophobic (contact angle of 123.4°),
and reaches V-0 level flame retardancy. This ultrahigh mmW transmission
material with excellent comprehensive performance provides an alternative
for solving the problems of mmW propagation in the existing dielectric
materials.