Effect of SnSb Particle Size on Creep Behaviour under Power Law Regime of Sn-10%Sb Alloy

Abstract

Cryst. Res. Technol. 34 1999 1 119-126 Sn-10 %Sb alloy was casted from the liquid state, drawn into wires of 0.55 mm in diameter or rolled into sheet of 0.2 mm thick. The as received as well as the heat treated specimens were examined by metallurgical microscope. Room temperature creep tests at constant loads were also carried out. The results obtained show that increasing annealing temperature, T a , affects the structure and properties of the alloy. The increase of T a leads to smaller SnSb particle size, therefore results in increasing its mechanical strength as measured by the decrease in steady state creep rate of specimen. The stress exponent parameter (m) calculated from the equation ε ú S = A σ m was found to have higher values than usual and to decrease by increasing annealing temperature which was related to the associated decrease of the SnSb particle size.

Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy

“…4 Therefore, the creep study of tin-antimony alloys has received a great deal of attention. 1,2,[5][6][7] The general conclusion is that while antimony atoms in solution have only a minor effect on the creep resistance, alloys with higher concentrations of antimony contain cuboid and whisker-type SnSb precipitates, which provide a significant composite strengthening effect that reduces the creep rate of the material especially at temperatures below 100°C.…”