Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system

Surendar, A.; Samavatian, Vahid; Maseleno, Andino; Ibatova, Aygul Z.; Samavatian, Majid

doi:10.1007/s10854-018-9667-y

Cited by 30 publications

(14 citation statements)

References 26 publications

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“…Thanks to the publicity available resources 5,[39][40][41][42][43][44][45] , we also created a huge number of input data to enrich the data resource needed to train the proposed model. It is worth-mentioning that all the collected data are extracted from the finite element model (FEM) simulation outcomes.…”

Section: Proposed Methodologymentioning

confidence: 99%

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Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

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Section: Proposed Methodologymentioning

confidence: 99%

“…The details of FEM procedure, done by authors, are given in Ref. 39,44 . From each resource, we gathered the input datasets including composition (material and physical properties of the joint zone), thermal loading specifications and solder joint geometry.…”

Section: Proposed Methodologymentioning

confidence: 99%

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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“…As it was mentioned, the most dominant failure mechanism in SnAgCu solder joint is creep-fatigue phenomena reported in numerous studies [25,26]. The main reasons are low melting temperature of solder and large differences in main parts of power module.…”

Section: Fem Analysismentioning

confidence: 99%

Role of alternating current shape on microstructure and damage evolution of solder joints

Siswanto

Krasnopevtsev

Talarpoushti

et al. 2020

Journal of Manufacturing Processes

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“…In [8] producing a new approach for cryptanalysis of DES cipher, such approach has enabled us in the first known-plaintext attack of the full 16-round DES cipher and the starting pace towards the only-ciphertext attack, and to dip further deeply into the onlyciphertext attack. In [9] presented the essential notions of linear and differential cryptanalysis as applicable to a basic Cipher. In [10] presenting the solutions for the two open problems by using Matsui's Algorithm 2 with multiple linear approximations posed earlier by Biryukov, De Canniere and M. Quisquater at Crypto'04.…”

Section: Related Workmentioning

confidence: 99%

“…Step 7:tx←expansion function of (R0) see figure 3.7 in [8 ] Step 8 : T1←Tx(1 to 8), T2=Tx (9,16) Step 9 : Trow←Concatinate(T1(1 to 2),T1(7 to 8))…”

Section: Algorithm To Find Probability and Bais Of Linear Expressionmentioning

confidence: 99%

Linear Cryptanalysis of S-Box BRADG

Oraby¹,

Albermany²

2018

IJET

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Block cipher reaction automata direct graph (BRADG) is used in protection wireless networks. BRADG processes data blocks of B bits with key length of B bits and given ciphertext of size B bits, where B is 64,128,512,...bits. BRADG is a faster and more efficient way to encrypt large data compared with the previous design of block cipher. In this thesis, the researcher presented a study to attack for BRADG algorithm by using linear cryptanalysis technique, by known-plaintexts and corresponding of the ciphertexts. As the results, it's possible to break: one bit in subkey 1-state BRADG cipher with at least 2 to power 3known-plaintext, and 16 bits subkey 1-state BRADG cipher with 2 to power 24 known plaintexts. The success rate of each attack is 84% , 92% ,97% and 99% depending on the number of known plaintext and the probability that the equation of the best approximation holds.

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Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system

Cited by 30 publications

References 26 publications

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Role of alternating current shape on microstructure and damage evolution of solder joints

Linear Cryptanalysis of S-Box BRADG

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