Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations

Cavallaro, Daniela; Greco, Rosario; Bazzano, Gaetano

doi:10.1016/j.microrel.2018.07.082

Cited by 15 publications

(8 citation statements)

References 1 publication

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“…Thanks to the publicity available resources 5,[39][40][41][42][43][44][45] , we also created a huge number of input data to enrich the data resource needed to train the proposed model. It is worth-mentioning that all the collected data are extracted from the finite element model (FEM) simulation outcomes.…”

Section: Proposed Methodologymentioning

confidence: 99%

“…www.nature.com/scientificreports/ time. Previous studies have reported that the solder joint geometry plays a key role on its useful lifetime 2,42,66 . Principally, the bulkier the solder material, the more elastic and inelastic strains are induced in the solder material leading to accelerated degradation.…”

Section: Proposed Methodologymentioning

confidence: 99%

“…( 3 ), one can find that while the contribution of the fatigue failure mechanism in the solder joint degradation heavily depends on the temperature swing ΔT j (temperature heating up and cooling down rates), the contribution of the creep failure mechanism mainly depends on the dwelling temperature and time. Previous studies have reported that the solder joint geometry plays a key role on its useful lifetime 2 , 42 , 66 . Principally, the bulkier the solder material, the more elastic and inelastic strains are induced in the solder material leading to accelerated degradation.…”

Section: Proposed Methodologymentioning

confidence: 99%

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Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

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Section: Proposed Methodologymentioning

confidence: 99%

Section: Proposed Methodologymentioning

confidence: 99%

Section: Proposed Methodologymentioning

confidence: 99%

See 1 more Smart Citation

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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“…Cavallaro [7] and Borgesen [8] analyzed damage caused by thermal cycles, thermal shock cycles and power cycles. The most damaging sequence starts with thermal cycles [8].…”

Section: Introductionmentioning

confidence: 99%

Automotive optoelectronic components submitted to thermal shock: Impact of component architecture on mechanical reliability

Noçairi

Maarouf

Roucoules

et al. 2022

Microelectronics Reliability

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“…Moreover, the range of inelastic strain stabilizes with the increase in the number of power cycles. Cavallaro et al 13 investigated the impact of solder layer thickness on MOSFET device reliability under thermal and power cycles. They used strain based Coffin-Manson fatigue model to estimate cycles to failure and have concluded that the increased thickness leads to an increase in the number of cycles to failure, that is, until a thickness limit is reached.…”

Section: Introductionmentioning

confidence: 99%

Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

Halouani

Cherouat

Chaabane³

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part C:

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An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain, stress, and number of cycles to failure have been calculated according to a strain life Coffin–Manson and energy-based Morrow fatigue models. Scanning electron microscopy imaging at the end of thermal cycle was used to evaluate the damage initiation and propagation. The effect of the solder volume on fatigue life of solder joints was discussed. Through analyses of theoretical results and experimental data on fatigue life, cracks initiation and propagation have been highlighted and their possible causes have been discussed.

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Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations

Cited by 15 publications

References 1 publication

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Automotive optoelectronic components submitted to thermal shock: Impact of component architecture on mechanical reliability

Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

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