Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering

Le, Minh-Tung; Sohn, Yong-Un; Lim, Joo Won; Choi, Good-Sun

doi:10.2320/matertrans.m2009183

Cited by 86 publications

(45 citation statements)

References 17 publications

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“…In the literature, a lot of studies focus on the evolution of copper microstructure as function of the deposition method and its process parameters variations, especially for DC magnetron sputtering. Studies on the resistivity evolution as function of film thickness or process parameters are also found [5,18,23,24,37,38]. However, crystallite size and/or crystallinity and film texture are not always specified.…”

Section: Electrical Resistivitymentioning

confidence: 99%

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A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

et al. 2017

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:A comparison of crystallinity, microstructure, surface morphology and electrical conductivity is proposed for the deposition of copper films, using supercritical fluid chemical deposition (SFCD) and RF magnetron sputtering techniques. Both preparation methods yield nanocrystalline Cu films (< 100 nm) but SFCD gives access to a higher crystallinity for the same AlN substrate temperature during the deposit. Based on the film characteristics, a comparison of the evolution of electrical properties is done for RF magnetron sputtered copper films and SFCD ones with H2 as reducing agent. Uniform strain values are significantly reduced when SFCD technique is used and crystallinity is highly increased leading to lower resistivity values for a same crystallite size. This study demonstrates the viability of the SFCD technique to produce high quality nanostructured copper thin films with low resistivity values.

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Section: Electrical Resistivitymentioning

confidence: 99%

“…A summary diagram of resistivity data as function of the crystallite size and the deposit technique is reported in Fig. 3 [5,22,23,[37][38][39][40][41][42][43]. Resistivity values for very thin films obtained by thermal evaporation [39], using electroplating [41] and electroless plating [42] are also reported.…”

Section: Electrical Resistivitymentioning

confidence: 99%

A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

et al. 2017

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“…Coating growth depends on a number of process parameters, including substrate bias, deposition temperature, chamber pressure, etc. Sputtering power as a process parameter influences the coating growth, electric resistance, surface roughness [35], mechanical and tribological properties [36]. Past research proved that high metal ionization results from increased sputtering power, eventually affecting coating growth.…”

Section: Introductionmentioning

confidence: 99%

Sputtering Power Effects on Growth and Mechanical Properties of Cr2AlC MAX Phase Coatings

Naveed

Obrosov

Żak

et al. 2016

Metals

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Abstract:Coating growth and mechanical properties of nanolamellar Cr 2 AlC coatings at various sputtering power were investigated in the present study. Cr 2 AlC coating was deposited on the IN 718 superalloy and (100) Si wafers by DC magnetron sputtering at different sputtering powers. The structure and properties were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and nanoindentation. It was found that coatings had columnar structure with nanocrystalline substructure. Deposition rate increased with the sputtering power. XRD results showed the presence of the Cr 2 AlC MAX phase, intermetallic AlCr 2 and Cr 7 C 3 carbide phases, along with the change in preferential coating growth orientation. TEM observations confirmed the occurrence of these phases, and the SAED patterns demonstrated significant texture of the coatings. Hardness values were measured in the range between 11-14 GPa, showing a slight increase with the sputtering power.

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“…The rough surface that appears clearly in the AFM image could be caused by an island growth mode at the sputtering condition. [34] In contrast, the CuN film exhibits a very flat surface with R a ≈ 0.3 nm and P-V ≈ 2.8 nm, which is similar to the optimally flat surface with R a ≈ 0.35 nm for CPP-GMR devices. [11] The significant reduction in roughness can be due to the improved lattice matching with the MgO substrate and/or the modification of the surface and interfacial energies by the N 2 gas.…”

Section: Wwwadvelectronicmatdementioning

confidence: 79%

Epitaxial CuN Films with Highly Tunable Lattice Constant for Lattice‐Matched Magnetic Heterostructures with Enhanced Thermal Stability

Wen

Kubota

Takanashi

2017

Adv Elect Materials

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The engineering of advanced materials for lattice‐matched magnetic heterostructures with remarkable magnetoelectric properties is of particular importance for future spintronic devices. Here, epitaxial CuN films with highly tunable lattice constant and resistivity are fabricated. The lattice constant of the CuN films is controlled from 0.362 to 0.388 nm, and the resistivity is varied over a range of more than two orders of magnitude. Lattice‐matched CuN/Co2Fe0.4Mn0.6Si (CFMS) heterostructures are achieved. A dramatic enhancement of the thermal stability of the heterostructure over that of Cu/CFMS is observed. Furthermore, magnetoresistance nanojunctions are fabricated using lattice‐matched CuN spacers, and an enhancement of the magnetoresistance effect at high annealing temperatures is observed. This work shows that the manipulation of the lattice constant and resistivity of CuN films in lattice‐matched heterostructures can be important for engineering future advanced electronic materials for the development of spintronic devices.

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Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering

Cited by 86 publications

References 17 publications

A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

Sputtering Power Effects on Growth and Mechanical Properties of Cr2AlC MAX Phase Coatings

Epitaxial CuN Films with Highly Tunable Lattice Constant for Lattice‐Matched Magnetic Heterostructures with Enhanced Thermal Stability

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