Effect of squeezing conditions on the particle distribution and bond line thickness of particle filled polymeric thermal interface materials

Shirazy, Mahmood R. S.; Allard, S.; Beaumier, Martin; Fréchette, Luc

doi:10.1109/itherm.2014.6892289

Cited by 7 publications

(1 citation statement)

References 14 publications

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“…Work on understanding and improving the BLT and solid-liquid contact resistances, starting with more realistic models of loaded paste flow and capillary physics [34][35][36][37][38], is far more limited. Approaches to modifying TIM deformation during assembly flow through surface patterning have shown how to reduce the BLT from 10s to single micrometres [39][40][41], as well as improving the distribution of loaded particles [42,43] through both design of hierarchal channels and increased rate of TIM compression. These novel effects are schematically summarised in Figure 4.…”

Section: Physical Considerationsmentioning

confidence: 99%

Present and future thermal interface materials for electronic devices

Razeeb

Dalton

Cross

et al. 2017

International Materials Reviews

284

164

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Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-toambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm −2 and <0.2 °CW −1 , respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things.

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Section: Physical Considerationsmentioning

confidence: 99%

Present and future thermal interface materials for electronic devices

Razeeb

Dalton

Cross

et al. 2017

International Materials Reviews

284

164

View full text Add to dashboard Cite

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Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Zhang

Zeng

Zhai

et al. 2017

Macro Materials & Eng

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Recent years have witnessed a staggering escalation in the power density of modern electronic devices. Because increasingly high power density accumulates heat, efficient heat removal has become a critical limitation for the performance, reliability, and further development of modern electronic devices. Thermal interface materials (TIMs) are widely employed between the two solid contact surfaces of heat sources and heat sinks to increase heat removal for electric devices. Composites of graphene and matrix materials are expected to be the most promising TIMs because of the remarkable thermal conductivity of graphene. Here, the recent research on the thermal properties of graphene filled polymer composite TIMs is reviewed. First, the composition of graphene filled polymer composite TIMs is introduced. Then, the synthetic methods for graphene filled polymer composite TIMs are primarily described. This study focuses on introducing the methods for improving and characterizing the thermal properties of graphene filled polymer composite TIMs. Furthermore, the challenges facing graphene filled polymer composite TIMs for thermal management applications in the modern electronic industry and the further progress required in this field are discussed.

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Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions

Lai,

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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Effect of squeezing conditions on the particle distribution and bond line thickness of particle filled polymeric thermal interface materials

Cited by 7 publications

References 14 publications

Present and future thermal interface materials for electronic devices

Present and future thermal interface materials for electronic devices

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions

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