2018
DOI: 10.1007/s42452-018-0044-5
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Effect of stand-off height on the shear strength of ball grid array solder joints under varying pad sizes

Abstract: The solder joints of ball grid array utilized in consumer electronics systems or assemblies degrade and fail overtime. Their degree of degradation is more critical, especially at elevated temperatures and mechanical loading conditions. This study presents the effect of component standoff height (CSH) on the shear strength reliability of ball grid array solder joints under different pad sizes. Investigation of the impact of standoff height on the mechanical reliability of the solder joint of ball grid array com… Show more

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Cited by 5 publications
(3 citation statements)
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“…Ogunsemi et al [20] analyzed the influence of the overall solder ball height on the shear strength of BGA solder joints. Failure treatment had been performed on the samples at 150 • C for 8 days to establish the relationship between the height of the gap between the pads under different pad sizes and the shear strength of solder joints.…”
Section: Research Methods For Fatigue Failure Of Solder Joints Under ...mentioning
confidence: 99%
See 1 more Smart Citation
“…Ogunsemi et al [20] analyzed the influence of the overall solder ball height on the shear strength of BGA solder joints. Failure treatment had been performed on the samples at 150 • C for 8 days to establish the relationship between the height of the gap between the pads under different pad sizes and the shear strength of solder joints.…”
Section: Research Methods For Fatigue Failure Of Solder Joints Under ...mentioning
confidence: 99%
“…This is because the BGA solder joints are deformed and even damaged due to external loads [14][15][16][17][18]. Therefore, analysis of mechanical properties and fatigue life prediction of BGA solder joints are hotspot studies in the field of electronic products' reliability [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…This study presents simplified techniques developed for predicting solder ball collapse height that would be very useful for package designers to use and make the design and development much faster. Aside from being necessary in meeting the overall package thickness requirement even during the design stage, accurate prediction of solder ball collapse height is also very important as it several studies [8][9][10][11][12][13]] that solder joint shape and height have significant effect on solder joint reliability or fatigue life. The accuracy of any solder joint reliability modeling would be dependent on the accuracy of the solder joint shape and height estimation.…”
mentioning
confidence: 99%