Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Sharif, Ahmed; Chan, Y.C.

doi:10.1016/j.mee.2006.10.087

Cited by 40 publications

(19 citation statements)

References 24 publications

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“…[5][6][7][8][9][10][11] A number of studies [11][12][13][14] have also been focused on alloys of multicomponent systems such as Sn-Zn-Ag, 12 Sn-Ag-Cu, 13,14 Sn-Zn-In, 15 Sn-Zn-Bi, 16,17 Sn-Zn-Ag-Al, and Sn-Zn-Ag-Al. 7 However, these solder alloys require accurate preparation in terms of chemical composition and some modifications of existing production plants due to their higher melting temperatures compared with the Sn-Pb eutectic alloy.…”

Section: Introductionmentioning

confidence: 99%

“…Some other operational aspects have limited the adoption of these candidate replacements for Pb-free alloys for certain soldering applications. 3 For flip-chip or ball-grid-array (BGA) joint technologies, 7,17 it is expected that the resulting surface microstructure, composition, and properties can unintentionally and considerably differ from those of the nominal composition when multicomponent alloys are used. Considering these limitations, binary alloys are preferred, particularly Sn-Zn alloys, because it is expected that they will enable existing production lines to be used without any modification.…”

Section: Introductionmentioning

confidence: 99%

“…Benefit can also be attained due to the mechanical integrity provided to electronic packaging, manufacturability, and relatively low cost. 4,17 In contrast, Suganuma and Kim 3 reported that the application of Sn-Zn alloys as Pb-free solder has some drawbacks, such as poor oxidation resistance in high-temperature/humidity conditions and poor compatibility with Cu substrates at elevated temperature.…”

Section: Introductionmentioning

confidence: 99%

“…Wetting balance test (contact or wetting angle measurement), spread test, solder ball, slump test, and ball shear test are the most common standard procedures carried out in order to characterize the wettability of solder alloys on substrates. 4,17,25 The present work is a comparative experimental study focusing on the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys, with a view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties (ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.% Zn), and a eutectic Sn-9wt.%Zn alloy were examined and compared with the corresponding results of the conventional Sn-40wt.%Pb solder alloy.…”

Section: Introductionmentioning

confidence: 99%

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Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Garcia

Osório

Peixoto

et al. 2009

Journal of Elec Materi

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A comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties (ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Garcia

Osório

Peixoto

et al. 2009

Journal of Elec Materi

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“…However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Medgyes

Illés

Harsányi

2013

Per. Pol. Elec. Eng.

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The reliability investigation of lead-free solders is still a current issue. In this paper, Electrochemical Migration (ECM) behaviour of novel lead-free micro-alloyed low Ag content solders was investigated by water drop test in IntroductionIn microelectronics industry, the applied solder materials are one of the most important factors related to the reliability of the products. According to the Restrictions of Hazardous Substances (RoHS) directive of European Union, lead bearing solders had to be replaced with lead-free ones [1]. In this context, alternative binary alloys had been examined as replacements for SnPb solders, such as near-eutectic SnAg, SnCu and SnZn alloys. However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].The reliability investigation of lead-free solders is still a current issue. One of the important reliability topics is the electrochemical migration (ECM) failure phenomenon. The common characteristics of the ECM phenomenon include the presence of moisture on conductor-dielectric-conductor systems under bias voltage, the electrochemical process and the metallic dendrite growth. This process is driven by the applied electric field from the anode to the cathode. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in needle or tree-like formations. This effect causes short-circuits in electronic circuits, which may lead to a catastrophic failure.Many papers can be found about ECM investigations carried out on different lead-free solder alloys. Takemoto et al. have found that some tin based lead-free solder alloys are more resistant to ECM than Sn-Pb40 alloy and pure Indium. In-48Sn and In-50Pb alloys were found to be immune to ECM in high purity water [8]. Yu et al. have described that in Sn-37Pb and Sn-36Pb2Ag systems the main migration element is Pb, while in Sn-Ag and Sn-Ag-Cu solder alloys Sn leads the migration in high purity water [9,10].Other publication reported that SAC305 lead-free solder alloy has longer ECM lifetime in 0.001% NaCl solution than in 0.001% Na2SO4, since the passivity layer formed of SnO2 is thicker in the case of NaCl solution and Sn is the only element that contributes to ECM at room temperature [11]. The migration behaviour and the deposition process of Sn, Cu and Ag in case of SAC305 solder alloy were also observed in a thermal-

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Characterization of Zn – Mo and Zn – Cr Pb ‐Free Composite Solders as a Potential Replacement for Pb ‐Containing Solders

Islam

Sharif

2019

Harsh Environment Electronics

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Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Cited by 40 publications

References 24 publications

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Characterization of Zn – Mo and Zn – Cr Pb ‐Free Composite Solders as a Potential Replacement for Pb ‐Containing Solders

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