Effect of substrate thickness and material on heat transfer in microchannel heat sinks

Koşar, Ali

doi:10.1016/j.ijthermalsci.2009.11.004

Cited by 67 publications

(30 citation statements)

References 22 publications

(17 reference statements)

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“…Kosar [26] numerically studied the effect of substrate thickness and substrate material on heat transfer in microchannel heat sinks by considering square microchannels (size 200 m 200 m) on different substrate thicknesses (100-1,000 m) and different substrate materials (polyimide, silica glass, quartz, steel, silicon, copper). For constant heat flux applied on the bottom of the substrate, Kosar [26] found that the Nusselt number is lower for low thermal conductivity materials and higher for high conductivity materials.…”

Section: Axial Back Conduction In Micro-sized Channelsmentioning

confidence: 99%

“…For constant heat flux applied on the bottom of the substrate, Kosar [26] found that the Nusselt number is lower for low thermal conductivity materials and higher for high conductivity materials. It was concluded that for low thermal conductivity materials, a significant deviation from the constant heat flux boundary condition occurs at the solid-fluid interface.…”

Section: Axial Back Conduction In Micro-sized Channelsmentioning

confidence: 99%

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Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Khandekar

Moharana

2015

Springer Tracts in Mechanical Engineering

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Recent developments during the last decade in the field of manufacturing and development of many high-power mini-/micro-devices led to increased interest in microfluidic devices involving heat transfer. Since the pioneering work by Tuckerman and Pease (IEEE Electron Device Lett 2:126-129, 1981) on the use of microchannels for high heat flux removal, certainly a lot of developments has been witnessed through ever-increasing analytical, experimental, and highly sophisticated numerical studies by many researchers across the globe. In spite of this progress, many fundamental understandings of flow and heat transfer phenomena in mini-/microchannel systems are still obscure. One such phenomenon is the flow of heat in the solid wall of microchannel systems by means of conduction normally in a direction opposite to that of internal convective mini-/microchannel flow of fluid, called "axial wall conduction" or "axial back conduction." Axial back conduction is not a new phenomenon, rather mostly neglected unintentionally because of its convincingly smaller influence on heat transfer in conventional-size channels. As the hydraulic diameter of a channel decreases, the coupling between the substrate and bulk fluid temperatures becomes significant because of the relative size of the fluid to the solid wall. Unlike in conventional-size channels, negligence of axial back conduction along the solid walls of micro heat exchangers frequently leads to erroneous conclusions and inconsistencies in the interpretation of transport data. Thus, it is important to explicitly identify the thermofluidic parameters of interest which lead to a distortion in the boundary conditions and thus the true estimation of species transfer coefficients. In this chapter, we focus our attention on the axial back conduction in the solid substrate/channel wall as against the axial back conduction in the liquid flow domain; thus, a detailed review of the state-of-the-art on axial back conduction in both conventional as well as mini-/microchannel systems is presented.

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Section: Axial Back Conduction In Micro-sized Channelsmentioning

confidence: 99%

Section: Axial Back Conduction In Micro-sized Channelsmentioning

confidence: 99%

Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Khandekar

Moharana

2015

Springer Tracts in Mechanical Engineering

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“…Otro de los temas estudiados actualmente para la mejora en los sistemas de disipación de calor es la predicción del flujo en microcanales (Thome et al, 2010), el efecto del espesor, la influencia del tipo de material utilizado en ellos (Kosar, 2009) y el efecto de la forma del microcanal en la caída de presión (Dang et al, 2010).…”

Section: Introductionunclassified

Modelación y simulación de disipadores de calor para procesadores de computadora en COMSOL Multiphysics

Garro-Acón¹,

Díaz-Espinoza²,

Jiang³

et al. 2012

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En este estudio se analizó la transferencia de calor en tres disipadores de calor utilizados para enfriar los procesadores de computadoras de escritorio. El objetivo de estos disipadores es evitar el sobrecalentamiento de la unidad de procesamiento y la consecuente reducción de la vida útil del computador. Los disipadores de calor se modelaron usando COMSOL Multiphysics con las dimensiones reales de los dispositivos y la generación de calor se modeló con una fuente puntual. Luego se modificaron los diseños de los disipadores para lograr una temperatura más baja en la zona más caliente del procesador. El resultado fue una reducción en la temperatura en el rango de 5-78 grados Kelvin, al rediseñarse el disipador de calor con variaciones feasibles como la reducción del grosor de las placas de intercambio de calor y el aumento de su número. Esto demuestra la posibilidad de desarrollar diseños optimizados para disipadores de calor que no requieran más materiales sino una mejor ingeniería. El trabajo se inició como parte del curso CM-4101 Modelización y Simulación.

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“…In contrast, Nonino et al [13] analyzed the circular microtube using conjugate heat transfer, for which no approximation was introduced at the fluid-wall boundary. Recently, Kosar [14] analyzed the effect of the wall thickness and the wall material on heat transfer mechanism for a rectangular geometry with a fixed size, that is, only one geometry was studied. Although the results are presented in terms of nondimensional quantities, the analysis was dimensional.…”

Section: Introductionmentioning

confidence: 99%

The effect of axial conduction on heat transfer in a liquid microchannel flow

Cole

Çetin

2011

International Journal of Heat and Mass Transfer

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Effect of substrate thickness and material on heat transfer in microchannel heat sinks

Cited by 67 publications

References 22 publications

Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Modelación y simulación de disipadores de calor para procesadores de computadora en COMSOL Multiphysics

The effect of axial conduction on heat transfer in a liquid microchannel flow

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