The optimization of multicomponent emissive layer (EML) deposition by slot-die coating for organic light-emitting diodes (OLEDs) is presented. In the investigated EMLs, the yellow-green iridium complex (Ir) was doped in two types of host: a commonly used mixture of poly(N-vinylcarbazole) (PVK) with oxadiazole derivative (PBD) or PVK with thermally activated delayed fluorescence-assisted dopant (10-(4-(4,6-diphenyl-1,3,5-triazin-2-yl)phenyl)-10H-spiro[acridine-9,9′-fluorene], SpiroAC-TRZ). In this article, OLEDs with EML prepared in air by slot-die coating, facilitating industrial manufacturing, are confronted with those with spin-coated EML in nitrogen. OLEDs based on PVK:PBD + 2 wt.% Ir-dopant exhibit comparable performance: ~13 cd A−1, regardless of the used method. The highest current efficiency (21 cd A−1) is shown by OLEDs based on spin-coated PVK with 25 wt.% SpiroAC-TRZ and 2 wt.% Ir-dopant. It is three times higher than the efficiency of OLEDs with slot-die-coated EML in air. The performance reduction, connected with the adverse oxygen effect on the energy transfer from TADF to emitter molecules, is minimized by the rapid EML annealing in a nitrogen atmosphere. This post-treatment causes more than a doubling of the OLED efficiency, from 7 cd A−1 to over 15 cd A−1. Such an approach may be easily implemented in other printing techniques and result in a yield enhancement.