Abstract:Integrated circuits (IC) are produced by deposition and modification of different dielectric and metal layers on a silicon wafer. Because of the continuing miniaturization of the device dimensions and the requirements of interconnecting an increasing number of devices on a chip, building multilevel interconnections on planarized levels has become an essential part of IC production. Chemical mechanical planarization (CMP) is a process of smoothing the dielectric and metal films in the process of integrated circ… Show more
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