2023
DOI: 10.1016/j.microrel.2023.115031
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Effect of temperature on the low cycle fatigue properties of BGA solder joints

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Cited by 13 publications
(1 citation statement)
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“…Several factors contribute to the LCF occurrence in solder joints of electronic components, which have been evaluated in several works. To give some examples, Wei et al (2023a) reported that the OSP surface finish significantly improved the LCF lifetime of solder joints at various temperatures. In another study, focusing on SAC solder joints, an LCF damage model based on entropy generation is proposed, calibrated with peak stress degradation, and reveals the irreversible nature of internal entropy generation (Long et al , 2023a).…”
Section: Introductionmentioning
confidence: 99%
“…Several factors contribute to the LCF occurrence in solder joints of electronic components, which have been evaluated in several works. To give some examples, Wei et al (2023a) reported that the OSP surface finish significantly improved the LCF lifetime of solder joints at various temperatures. In another study, focusing on SAC solder joints, an LCF damage model based on entropy generation is proposed, calibrated with peak stress degradation, and reveals the irreversible nature of internal entropy generation (Long et al , 2023a).…”
Section: Introductionmentioning
confidence: 99%