2018
DOI: 10.1007/s12540-018-0155-y
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Effect of the Deformation State on the Mechanical Degradation of Cu Metal Films on Flexible PI Substrates During Cyclic Sliding Testing

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Cited by 10 publications
(2 citation statements)
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“…Interrupted bending tests were also conducted on the same-sized specimens at an interval of a bending angle of 3°. According to the previous bending procedures coupled with a digital image correlation (DIC) technique 35 37 , the local tensile strain was concentrated mainly at the center of the outer surface of the bend specimen. Thus, the specimen was bent at a certain bending angle, taken out from the test set-up, and half-sectioned along the longitudinal direction.…”
Section: Methodsmentioning
confidence: 99%
“…Interrupted bending tests were also conducted on the same-sized specimens at an interval of a bending angle of 3°. According to the previous bending procedures coupled with a digital image correlation (DIC) technique 35 37 , the local tensile strain was concentrated mainly at the center of the outer surface of the bend specimen. Thus, the specimen was bent at a certain bending angle, taken out from the test set-up, and half-sectioned along the longitudinal direction.…”
Section: Methodsmentioning
confidence: 99%
“…23,24 In addition, some scholars have also conducted some numerical studies. Using finite element analysis, Bag et al 25 studied the Cu thin film's deformation behavior and strain distribution on a flexible PI substrate during the cyclic sliding test. Using molecular dynamics simulation, Chang and Fang.…”
Section: Introductionmentioning
confidence: 99%