2021
DOI: 10.1016/j.tca.2020.178812
|View full text |Cite
|
Sign up to set email alerts
|

Effect of the kind of cupric compound deposit on thermal decomposition of anion exchangers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

2
16
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
5

Relationship

2
3

Authors

Journals

citations
Cited by 7 publications
(18 citation statements)
references
References 33 publications
2
16
0
Order By: Relevance
“…It is apparent that the HIXs with Cu 0 particles contained considerably less hydration bound water than the HIXs with Cu 2 O particles. This content for M/Cu (7.2%) and G/Cu (4.3%) was anomalously low as the pure resins (both anion exchangers) had about 15% hygroscopic water content [ 30 , 31 ]. Typically, in the parent resins (M, G) the functional ionogenic groups were surrounded by water molecules, which is referred to as solvation.…”
Section: Resultsmentioning
confidence: 99%
See 4 more Smart Citations
“…It is apparent that the HIXs with Cu 0 particles contained considerably less hydration bound water than the HIXs with Cu 2 O particles. This content for M/Cu (7.2%) and G/Cu (4.3%) was anomalously low as the pure resins (both anion exchangers) had about 15% hygroscopic water content [ 30 , 31 ]. Typically, in the parent resins (M, G) the functional ionogenic groups were surrounded by water molecules, which is referred to as solvation.…”
Section: Resultsmentioning
confidence: 99%
“…One of the causes of the higher hygroscopicity of M/Cu 2 O and G/Cu 2 O in comparison with M/Cu and G/Cu could be the presence of functional groups in the OH − form, which shows a very strong affinity for water [ 39 ]. It is worth mentioning than the HIXs with Cu 2 O particles contained clearly less hydration bound water (about 10%) than the HIXs with CuO particles (about 13%) [ 31 ].…”
Section: Resultsmentioning
confidence: 99%
See 3 more Smart Citations