Effect of the solvent type and polymerization conditions on the curing kinetics, thermal and viscoelastic performance of poly(amide-imide) resins

Rasheva, Z.; Sorochynska, L.; Grishchuk, S.; Friedrich, K.

doi:10.3144/expresspolymlett.2015.21

Cited by 10 publications

(8 citation statements)

References 33 publications

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“…The peaks of the phenyl protons of the ISBA, PMDA, and BPDA units appear in the upfield region of 7.7–8.4 ppm, and the peaks of CH and CH 2 of the alicyclic ring in the ISBA and CBDA units appear in the downfield region of 3.6–5.4 ppm. The characteristic signals of the C–H group in CBDA are observed for shifting in signal of peak 7, attributed to the two forms of isomers with different steric structures . The minor peaks at 6.6 and 7.8–7.9 ppm would be assigned to the aromatic protons of the end groups of polymers, such as the p -aminophenyl groups.…”

Section: Resultsmentioning

confidence: 99%

“…The characteristic signals of the C−H group in CBDA are observed for shifting in signal of peak 7, attributed to the two forms of isomers with different steric structures. 38 The minor peaks at 6.6 and 7.8−7.9 ppm would be assigned to the aromatic protons of the end groups of polymers, such as the paminophenyl groups. Note that the alicyclic rings of ISBA and CBDA were derived from biosources ISB and maleic acid, respectively.…”

Section: Synthesis Of Co-pi Pi(isba-cmbn)mentioning

confidence: 99%

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High Performance Biomass-Based Polyimides for Flexible Electronic Applications

Chen

Lin

Hsu

et al. 2021

ACS Sustainable Chem. Eng.

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Biobased polymers have received extensive research attention in flexible and renewable electronics to meet the concept of environmental sustainability. In this study, we develop a series of new polyimides (PIs) from biosources to serve as the substrate and dielectrics for a flexible organic field-effect transistor (OFET). The bioderived diamine, (3R,6S)-hexahydrofuro[3,2-b]furan-3,6-diyl bis(4-aminobenzoate) (ISBA), synthesized from isosorbide (ISB), was reacted with three dianhydrides of pyromellitic dianhydride (PMDA), 3,3′,4,4′-biphenyl-tetracarboxylic dianhydride (BPDA), and cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) to obtain PIs and copolyimides (Co-PIs) with a high biomass content up to 53%. These bioderived PIs possessed high T d’s over 400 °C and T g’s over 250 °C. Furthermore, the CBDA-based and PMDA-based PIs exhibited CTE values below 50 ppm K–1 due to the rigid heterocyclic ISB unit and the structural linearity of the CBDA and PMDA moieties in the polymer backbone. High transparency and low coloration were also observed in the biobased PIs. Finally, highly thermal-resistant PI(ISBA-C95B5) consisting of the CBDA/BPDA mole ratio of 95/5 was applied as the substrate and dielectrics in flexible OFET, demonstrating the compatible and stable performance even after being baked at 200 °C for 2 h or 1000 bending cycles. The present study reveals the potential application of biobased PIs in electronic devices for a sustainable economy.

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Section: Resultsmentioning

confidence: 99%

Section: Synthesis Of Co-pi Pi(isba-cmbn)mentioning

confidence: 99%

High Performance Biomass-Based Polyimides for Flexible Electronic Applications

Chen

Lin

Hsu

et al. 2021

ACS Sustainable Chem. Eng.

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“…In addition, the absorptions at 2210 cm −1 , attributed to the carbon-carbon stretching vibrations in phenylethynyl groups (-C≡C-), were not disappeared even after being thermally treated at 260 °C, implying that no obvious thermal curing reaction occurred [ 39 ]. The characteristic peaks of isoimide around 1800 cm −1 and 905 cm −1 were not detected, implying that the imidization process didn’t produce the corresponding isoimide groups [ 40 ]. Figure 3 b compares the FT-IR spectra of the thermally cured blend resin (TMR–50/RDm–a–5) with the thermosetting matrix resin (TMR–50) and the reactive diluent (RDm–a) after cured at 380 °C/2 h. Obviously, the thermally cured TMR–50/RDm–a–5 exhibited the expected chemical structures.…”

Section: Resultsmentioning

confidence: 99%

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

et al. 2022

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With the goal of improving processability of imide oligomers and achieving of high temperature carbon fiber composite, a series of Thermosetting Matrix Resin solutions (TMR) were prepared by polycondensation of aromatic diamine (3,4′-oxybisbenzenamine, 3,4-ODA) and diester of biphenylene diacid (BPDE) using monoester of 4-phenylethynylphthalic acid (PEPE) as end-capping agent in ethyl alcohol as solvent to afford phenylethynyl-endcapped poly(amic ester) resins with calculated molecular weight (Calc’d Mw) of 1500–10,000. Meanwhile, a series of reactive diluent solutions (RDm) with Calc’d Mw of 600–2100 were also prepared derived from aromatic diamine (4,4′-oxybisbenzenamine, 4,4-ODA), diester of asymmetrical biphenylene diacid (α-BPDE) and monoester of 4-phenylethynylphthalic acid (PEPE) in ethyl alcohol. Then, the TMR solution was mixed with the RDm solution at different weight ratios to afford a series of A-staged thermosetting blend resin (TMR/RDm) solutions for carbon fiber composites. Experimental results demonstrated that the thermosetting blend resins exhibited improved melt processability and excellent thermal stability. After being thermally treated at 200 °C/1 h, the B-staged TMR/RDm showed very low melt viscosities and wider processing window. The minimum melt viscosities of ≤50 Pa·s was measured at ≤368 °C and the temperature scale at melt viscosities of ≤100 Pa·s were detected at 310–390 °C, respectively. The thermally cured neat resins at 380 °C/2 h showed a great combination of mechanical and thermal properties, including tensile strength of 84.0 MPa, elongation at breakage of 4.1%, and glass transition temperature (Tg) of 423 °C, successively. The carbon fiber reinforced polyimide composite processed by autoclave technique exhibited excellent mechanical properties both at room temperature and 370 °C. This study paved the way for the development of high-temperature resistant carbon fiber resin composites for use in complicated aeronautical structures.

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“…Figure 1 d plots the DSC–TGA curves of the precursor. As seen, the endothermic peaks at around 202 and 87 °C are, respectively, attributed to the evaporation of NMP and water from Cu(NO 3 ) 2 ·3H 2 O [ 25 , 26 ], while the exothermic peak at around 212 °C is related to the decomposition of Cu(NO 3 ) 2 [ 26 ]. Importantly, the peaks at around 180 °C (with a range from 140 to 200 °C) is identified in the DSC curve, which agrees to the decomposition temperature of EG [ 27 , 28 ].…”

Section: Resultsmentioning

confidence: 99%

Laser Erasing and Rewriting of Flexible Copper Circuits

2021

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Integrating construction and reconstruction of highly conductive structures into one process is of great interest in developing and manufacturing of electronics, but it is quite challenging because these two involve contradictive additive and subtractive processes. In this work, we report an all-laser mask-less processing technology that integrates manufacturing, modifying, and restoring of highly conductive Cu structures. By traveling a focused laser, the Cu patterns can be fabricated on the flexible substrate, while these as-written patterns can be selectively erased by changing the laser to a defocused state. Subsequently, the fresh patterns with identical conductivity and stability can be rewritten by repeating the writing step. Further, this erasing–rewriting process is also capable of repairing failure patterns, such as oxidation and cracking. Owing to the high controllability of this writing–erasing–rewriting process and its excellent reproducibility for conductive structures, it opens a new avenue for rapid healing and prototyping of electronics.

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Effect of the solvent type and polymerization conditions on the curing kinetics, thermal and viscoelastic performance of poly(amide-imide) resins

Cited by 10 publications

References 33 publications

High Performance Biomass-Based Polyimides for Flexible Electronic Applications

High Performance Biomass-Based Polyimides for Flexible Electronic Applications

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

Laser Erasing and Rewriting of Flexible Copper Circuits

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