2017
DOI: 10.1051/matecconf/201712902032
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Effect of the stacking fault energy on the mechanical properties of pure Cu and Cu-Al alloys subjected to severe plastic deformation

Abstract: Abstract. The effect of stacking fault energy (SFE) on the mechanical properties of pure Cu and alloys of Cu-2.2%Al and Cu-4.5%Al subjected to severe plastic deformation (SPD) was investigated. SPD was performed by equal channel angular pressing (ECAP) at room and cryogenic temperatures. It is established that the increase in the weight concentration of Al in the Cu matrix (a reduction of SFE) and decreasing the ECAP temperature leads to an increase of the strength characteristics. The observed tendency is cau… Show more

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“…The ECAP process involves that the metallic material is deformed by pressing through an equal cross-sectional channel with the right or obtuse angle [16]. After multiple ECAP processes, the micro-or nano-scaled UFGed microstructure can be obtained, leading to the high strength of alloys according to the Hall-Petch relationship [17][18][19][20]. The dislocations and grain boundaries introduced by the ECAP process have a limited influence on the electron scattering, and thus the good electrical conductivity of the alloy can be maintained [14].…”
Section: Introductionmentioning
confidence: 99%
“…The ECAP process involves that the metallic material is deformed by pressing through an equal cross-sectional channel with the right or obtuse angle [16]. After multiple ECAP processes, the micro-or nano-scaled UFGed microstructure can be obtained, leading to the high strength of alloys according to the Hall-Petch relationship [17][18][19][20]. The dislocations and grain boundaries introduced by the ECAP process have a limited influence on the electron scattering, and thus the good electrical conductivity of the alloy can be maintained [14].…”
Section: Introductionmentioning
confidence: 99%