Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints

Zhai, Xinmeng; Chen, Yue; Li, Yuefeng; Zou, Jun; Shi, Mingming; Yang, Bobo

doi:10.1007/s11664-021-09426-1

Cited by 7 publications

(2 citation statements)

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“…After the reflow soldering process, the Cu bars at both ends had a metallurgical reaction with solder SAC305. The Cu element in the Cu bars diffused to one side of the solder, and thus formed an IMC layer [ 2 ]. Figure 5 shows the microstructure of the solder joint and the EDS mapping of the different elements.…”

Section: Resultsmentioning

confidence: 99%

“…The failure of a solder joint is a problem that must be urgently addressed in the manufacturing industry of electronic and microelectronic products. Defects such as pores and microcracks in solder joints are a main cause for the low reliability of modern electronic equipment [ 1 , 2 ]. The defects reduce the conductivity and thermal conductivity of solder joints and they reduce the mechanical properties of solder joints owing to the stress concentration [ 3 , 4 ].…”

Section: Introductionmentioning

confidence: 99%

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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

Wang

Duan

et al. 2022

Materials

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The fracture behavior of the Cu/Sn-3.0Ag-0.5Sn (SAC305)/Cu solder joint was investigated by conducting tensile tests with in situ X-ray micro-computed tomography (μ-CT) observation, and finite element (FE) simulation. The tensile fracture process of solder joints with a real internal defect structure was simulated and compared with the experimental results in terms of defect distribution and fracture path. Additionally, the stress distribution around the defects during the tensile process was calculated. The experimental results reveal that the pores near the intermetallic compound (IMC) layers and the flaky cracks inside the solder significantly affected the crack path. The aggregation degree of the spherical pores and the angle between the crack surface and the loading direction controlled the initiation position and propagation path of the cracks. The fracture morphology indicates that the fracture of the IMC layer was brittle, while the solder fracture exhibited ductile tearing. There are significant differences in the fracture morphology under tensile and shear loading.

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Section: Resultsmentioning

confidence: 99%