Abstract:The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intemetallic compound, fine needle-like AuSn 4 was found at the solder/pad interface under as-bonded condition. After aging, Ag 3 Sn appeared in the solder bulk as a particle-like or elongated structure. Meanwhile, the intermetallic… Show more
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