Effect of Thermal Aging on Dynamic Mechanical Performance of a Novel Structural Adhesive

Abstract

This study mainly evaluates the thermal aging properties of a new room temperature cured structural adhesive. Multiple adhesive specimens were thermal aged at 80℃, 100℃, 120℃ and 140℃, respectively, and subjected to the dynamic mechanical analysis (DMA) at different temperatures and frequencies. According to the results of DMA and thermodynamic analysis, the performance of the adhesive changes little after aging at 80℃, 100℃ and 120℃ for 30 days. However, the adhesive performance became unstable at 140℃, and deteriorated rapidly with the extension of aging time. Hence, this structural adhesive is suitable for the environment below 120℃. In addition, the generalized curve of the structural adhesive aging for 20 days at 100℃ was obtained, following the principles of time-temperature equivalence superposition and time-aging time equivalence superposition. The test time was shortened significantly. This research provides an accelerated characterization strategy for the long-term mechanical properties of other polymers, making it possible to obtain the generalized curve of polymers aging for a specific time at a specific temperature.

Assessment of Durability and Aging Resilience in a Novel Structural Building Adhesive: An Examination of the Time-Temperature Equivalence Principle

“…In previous research, the mechanical acceleration characterization of the frequency spectrum curve of epoxy resin adhesive after thermal aging was carried out using the time-temperature equivalence principle and time-aging time equivalence principle [33]. The resulting generalized aging curve was obtained for 20 days under an aging temperature of 100℃ and a test temperature of 100℃.…”

“…The current study examines the accelerated characterization of the long-term properties of structural adhesives at 85%, 75%, and 65% relative humidity based on the aforementioned research. It further discusses the validity of selecting different reference temperatures when employing the time-temperature equivalence principle for the artificial accelerated characterization of this structural adhesive [31][32][33].…”