Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

Dutta, I.; Pan, Dongdong; Marks, Robert A.; Jadhav, S. G.

doi:10.1016/j.msea.2005.08.142

Cited by 142 publications

(65 citation statements)

References 19 publications

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“…The importance of knowing the exact failure mechanisms of lead-free solder joints with respect to reliable lifetime estimation was stated earlier, 45,46 although the results achieved from the limited accelerated tests in the laboratory conditions do not necessarily correspond exactly to the reliability of solder joints in field conditions. Nevertheless, the need for models to use in simulating strain/stress distribution in solder joints, estimating lifetime duration of solder joints, and designing reliable joint configurations for different microelectronic packages is obvious.…”

Section: Failure Mechanisms Of Test Assembliesmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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The thermal fatigue endurance of two lead-free solder/plastic-core solder ball (PCSB) composite joint structures in low-temperature co-fired ceramic (LTCC) modules was investigated using a thermal cycling test over a temperature range of À55°C to 150°C. The investigated solder alloys were Sn-7In-4.1Ag-0.5Cu (SAC-In) and 95.5Sn-4Ag-0.5Cu (SAC). Three failure mechanisms were observed in the test joints. Transgranular (fatigue) cracking mixed with minor intergranular cracking was the dominant failure mechanism at the outer edge of the joints in both test assemblies, whereas separation of the solder/intermetallic compound (IMC) interface and creep cracking occurred in the other parts of the test joints. The propagation rate of the transgranular crack was lower in the SAC-In joints compared with in the SAC joints. Furthermore, the SAC solder seemed to be more prone to separation of the solder/IMC interface, and more severe intergranular (creep) cracking occurred in it compared with in the SAC-In solder. In the thermal cycling test conditions, the better thermal fatigue endurance of the SAC-In solder composite joints resulted in a 75% higher characteristic lifetime compared with the SAC composite joints.

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Section: Failure Mechanisms Of Test Assembliesmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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“…Constitutive relations that ignore the microstructural evolution of precipitate distribution and size cannot accurately predict the stress-strain response of solder joints under combined effect of thermal and mechanical stress. In order to consider the microstructural coarsening effect, Dutta and colleagues [37][38][39][40][41][42][43] proposed a microstructurally adaptive creep model by incorporating Ansell-Weertman model as follows.…”

Section: Uncoupled Models For Creep Simulationmentioning

confidence: 99%

A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality and reliability of electronic products. In fact, the accuracy of reliability design of electronic packaging is dependent on accelerated reliability tests, material constitutive models, finite element modeling, and fatigue-life prediction models. Here, the material constitutive model plays the most important role in the development of electronic reliability design because the stress, strain, and strain energy density adopted in finite element modeling and fatigue-life prediction are all computed and derived from the constitutive model. In this work, the constitutive models developed for simulating the complex stress and strain response of solders are critically reviewed. To make the description concise and comprehensive, the constitutive models were categorized into two types: the constitutive models with and without the definition of yield surface. The prediction capabilities, application scope, merits and shortcomings, and objective suggestions for the further development of constitutive models for solders in electronic packaging are proposed.

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“…First, the properties of the solder joint change with time, as aging or cycling causes precipitate coarsening that results in a beneficial decrease in the strength and hardness of solder joints in the first hundred thermal cycles. [9][10][11] Furthermore, the anisotropic properties of Sn are strong functions of temperature, 12,13 as shown in Fig. 1, which illustrates how the coefficient of thermal expansion (CTE) and the elastic constants vary with temperature.…”

Section: Introductionmentioning

confidence: 96%

Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

Bieler

Lee

Liu

2009

Journal of Elec Materi

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To examine how a lead-free solder joint deforms in a thermal cycling environment, both the elastic and plastic stress and strain behavior must be understood. Methods to identify evolution of the internal strain (stress) state during thermal cycling are described. A slice of a package containing a single row of solder joints was thermally cycled from 0°C to 100°C with a period of about 1 h with concurrent acquisition of transmission Laue patterns using synchrotron radiation. These results indicated that most joints are single crystals, with some being multicrystals with no more than a few Sn grain orientations. Laue patterns were analyzed to estimate local strains in different crystal directions at different temperatures during a thermal cycle. While the strains perpendicular to various crystal planes all vary in a similar way, the magnitude of strain varies. The specimens were subsequently given several hundred additional thermal cycles and measured again to assess changes in the crystal orientations. These results show that modest changes in crystal orientations occur during thermal cycling.

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Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

Cited by 142 publications

References 19 publications

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

A critical review of constitutive models for solders in electronic packaging

Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

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