Effect of thermocouple wire size and attachment method on measurement of thermal characteristics of electronic packages

Temperature measurement during solidification of thin wall ductile cast iron. Part 1: Theory and experiment

“…The TC can also be preheated by radiation from the melt before it hits the TC. To simplify the problem the measured heating time of the TC was defined as the time between measured temperatures of 200 to 1000°C, t [2][3][4][5][6][7][8][9][10] . The HTC can then be calculated from equation (4) constant temperature but in reality the TC will cool the melt close to it.…”

“…1. A better approach is made by Shaukatullah and Claassen [9] in the experimental work of temperature measurement on electronic components. Here the TC was attached to the surface of the electronic component so the thermal conditions correspond better with Fig.…”

Effects of thermocouple electrical insulation on the measurement of surface temperature

“…The variation of h with the wire diameter can be calculated using Eq. (11). In this case there is no minimum value of thermal resistance as shown in Figure 7.…”

“…Shaukatullah and Claassen [11]performed experimental results for the temperature measurement of a chip surface with different thermocouple sizes and attachment methods. They advised that using a small diameter of thermocouple with lower thermal conductivity can minimize thermocouple wires conduction error.…”

“…Furthermore, fixing the thermocouple junction with a spot weld gave better results than soldering or condenser-discharge welding (Boelter and Lockhart [1]). Shaukatullah and Claassen [11]showed that using silver epoxy or silver epoxy with insulating epoxy to fix the thermocouple to the surface gave a good contact and consequently lower error in temperature measurement. Moreover, attaching the thermocouple to the surface with polyimide or aluminium tapes produced higher errors due to poor contact.…”