Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg

Sabzevari, Seyed Mostafa; Alavi-Soltani, Seyed R.; Minaie, Bob

doi:10.1007/s10973-011-1587-5

Cited by 21 publications

(4 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In addition to affecting the phase structure, curing processes determine the curing extent of the undissolved 20 wt% PEK/ DGEBA/M-DICY blends. 35,36 Hence, DSC that recorded the thermal effects accompanying the reaction was used to measure the curing degree at different curing stages. 37 Figure 5(a) shows that there is a wide temperature range over which the curing reaction of epoxy resin occurs.…”

Section: Curing Behaviour Of the Undissolved 20 Wt% Pek/ Dgeba/m-dicymentioning

confidence: 99%

Polyetherketone powder/epoxy blends with low viscosity and high mechanical properties

Wang

et al. 2020

High Performance Polymers

View full text Add to dashboard Cite

The difficult forming process and construction caused by high viscosity has been the main problem restricting the application of high-performance thermoplastic/epoxy blends. In this contribution, low viscous polyetherketone (PEK)/diglycidyl ether of bisphenol A epoxy resin (DGEBA) blends were prepared by mixing the ultrafine PEK powder and DGEBA monomer at ambient temperature. Rheological behaviour shows that complex viscosity of the undissolved blends containing 20 wt% PEK powder is two orders of magnitude lower than that of the dissolved one. Interestingly, diffusion and phase separation of PEK powder in the undissolved PEK/DGEBA/2-methylimidazole/dicyandiamide (M-DICY) blends are affected by the curing processes. Phase-inverted morphology was observed after curing at 120°C/1h + 160°C/0.5 h for the undissolved 20 wt% PEK/DGEBA/M-DICY blends which also exhibited outstanding tensile strength and lap shear strength both at 298 and 77 K. We believe this work should provide a new insight into the preparation of advanced thermoplastic/epoxy blends.

show abstract

Section: Curing Behaviour Of the Undissolved 20 Wt% Pek/ Dgeba/m-dicymentioning

confidence: 99%

Polyetherketone powder/epoxy blends with low viscosity and high mechanical properties

Wang

et al. 2020

High Performance Polymers

View full text Add to dashboard Cite

show abstract

“…As the output of the DSC during heating is in proportion to the heat capacity, it is a convenient and straightforward method of determining the glass transition and investigating of its kinetics [17,19,20]. For instance, the heating-rate dependence of T g can be investigated.…”

Section: Thermal Analysismentioning

confidence: 99%

Influence of PCBM on the Glass Transition Temperature (Tg) of Poly(N-Vinylcarbazole)-Based Photorefractive Composite

Chen

Huang

Yang

et al. 2017

MSF

View full text Add to dashboard Cite

2,5-dimethyl-(4-p-nitrophenylazo) phenetole (DMNPAPE) was synthesized. And its structure was confirmed with ultraviolet-visible (UV-vis) spectroscopy, Fourier transform infrared (FT-IR) spectra and 1H Nuclear Magnetic Resonance (1H NMR) spectroscopy. The photorefractive composite consist of 33 wt % poly (N-vinycarbazole) (PVK), 50 wt % 2, 5-dimethyl-(4-p-nitrophenylazo) phenetole (DMNPAPE) and 16 wt % ethyl carbazole (ECZ) doped with x wt % (≤1 wt%) [6, 6]-phenyl C61 butyric acid methyl ester (PCBM) was fabricated. The influence of PCBM on the glass transition temperature (Tg) of the photorefractive composite was studied using a differential scanning calorimetric (DSC) method. The active energy of glass transition (Eg) was evaluated by Kissinger’s and Moynihan’s relation. The analysis results indicate that the transition region shifts to higher temperatures with the increasing heating rate, and PCBM content (≤1.0 wt %) can influence Tg of PVK - based PR composite polymers. The Tg first increase and then went down with the PCBM content (below 1.0 wt %) increasing. The possible cause of the influence of PCBM on Tg was proposed.

show abstract

“…In order to improve the compressive strength after impact (CAI), some aeronautical composites such as M21C and X850 were toughened with epoxy resin with thermoplastic components to enhance the impact resistance. However, the addition of thermoplastic components affects the viscosity and process properties of the resin matrix, resulting in difficulties in bonding the interface between the resin and the adhesive [ 8 , 9 ]. In addition to the performance of the adhesive itself affecting the bonding performance of the composite adhesive structure, the surface properties of the substrate will also affect the bonding performance of the composite adhesive structure [ 10 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Low-Temperature Plasma Surface Treatment on Bonding Properties of Single-Lap Joint of Thermosetting Composites

Wen

Qin³

2023

Polymers

View full text Add to dashboard Cite

Bonding is one of the main forms of composite bonding. In order to investigate the effect of low-temperature plasma surface treatment on the bonding properties of carbon fiber-reinforced epoxy resin composites (CF/EP), a single-lap joint of CF/EP was prepared. The surface of the CF/EP was treated with atmospheric pressure “low-temperature plasma spray” equipment, and the tensile shear strength, surface morphology, surface contact angle and surface chemical composition of the CF/EP before and after plasma treatment were characterized. Finally, the samples were treated with traditional sandblasting, compared and analyzed. The results show that the effect of low-temperature plasma surface treatment on CF/EP joints is better than that of traditional sandblasting treatment. After low-temperature plasma surface treatment, the tensile shear strength of the CF/EP single-lap joint increased by 119.59% at most, and the failure form of the joint changed from untreated interface failure to mixed failure dominated by cohesion failure. Plasma can etch the surface of composite materials, the mechanical interlock between the carbon fiber and glue is enhanced and the bonding performance of the composite is improved. In addition, after low-temperature plasma surface treatment, the introduction of a large number of oxygen-containing active groups such as C-O and C=O can increase the surface free energy, reduce the contact angle and improve the surface activity and wettability of the composites. However, too long a treatment time will lead to excessive plasma etching of carbon fibers, thus weakening the active effect of the oxygen-containing active groups on the surface of the composites, and the surface wettability is no longer improved, but the adhesive properties of CF/EP are reduced. This paper plays a guiding role in the bonding technology of composite materials.

show abstract

Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg

Cited by 21 publications

References 17 publications

Polyetherketone powder/epoxy blends with low viscosity and high mechanical properties

Polyetherketone powder/epoxy blends with low viscosity and high mechanical properties

Influence of PCBM on the Glass Transition Temperature (<i>T</i><sub>g</sub>) of Poly(<i>N</i>-Vinylcarbazole)-Based Photorefractive Composite

Effect of Low-Temperature Plasma Surface Treatment on Bonding Properties of Single-Lap Joint of Thermosetting Composites

Contact Info

Product

Resources

About