Effect of thin film coating of Au on joint strength in invar-invar packages

Wang, S. C.; Wang, C. M.; Wang, C.; Chang, H.L.; Tu, Yuan‐Kuang; Hwang, Chi–Chuan; Chi, Sien; Wang, W. H.; Yang, Y. D.; Cheng, Wood-Hi

doi:10.1007/s11664-996-0038-8

Cited by 9 publications

(8 citation statements)

References 3 publications

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“…The gold-plated InP and the surface coating of Au thin film on Si submount were used to improve joint solderability. 8 The eutectic solder of Au(80)/Sn(20) with a melting temperature of 280°C produced by electroplating processes was used. The dimensions of the InP laser chip and Si submount were 0.3 ϫ 0.5 ϫ 0.1 mm 3 and 1 ϫ 4 ϫ 0.5 mm 3 , respectively.…”

Section: Laser-diode Packagementioning

confidence: 99%

The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages

Sheen¹,

Wang

et al. 2005

Journal of Elec Materi

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The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser-diode packages after thermal-aging testing were studied experimentally and numerically. Specimens were aged at 150°C for up to 64 days. The joint strength decreased as aging time increased. The microstructure and fracture surface of the Au/Sn solder joints showed that the joint strength decrease was caused by both the enlargement of the initial voids and an increase in the number of voids as the aging time increased. Finite-element method (FEM) simulations of joint strength were in good agreement with experimental measurements. Both experimental and numerical results indicate that the enlargement of the initial voids and an increase in the number of voids, caused by stress concentration as the aging period increased, resulted in the weakness of joint strength. The effect of temperature-cycling testing on the power variation of the InP laser diodes using fluxless Au/Sn solders was also studied. It was shown that the laser diodes operated in the stable condition up to 500 cycles.

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Section: Laser-diode Packagementioning

confidence: 99%

The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages

Sheen¹,

Wang

et al. 2005

Journal of Elec Materi

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“…A surface coating of Au thin film on the SUS304 substrate was used to improve joint solderability. 7 Two film thicknesses of the Au coating on the substrate, i.e., 2 m and 10 m, were used in this study. The solder joints of Al 2 O 3 -AuSn solder-SUS304 substrate and Al 2 O 3 -PbSn solder-SUS304 substrate assemblies (Fig.…”

Section: Laser-diode Packagementioning

confidence: 99%

“…The standard procedures for metallographic preparation are specimen sectioning, mounting, grinding and polishing, chemical etching, microscope examination, and measurements. 7 An optical microscope and a scan- ning electron microscope (SEM) were employed to observe the microstructure of Pb/Sn and Au/Sn solder joints. The specimens were carbon-coated before being put in the SEM.…”

Section: Microstructure Analysismentioning

confidence: 99%

“…Combining Eqs. 1-6, the stress {d}-strain {dε} relationship in this coupled thermo-elasto-plasticity model with Norton-Power creep law is expressed as 22 (7) where [C ep ], [C th ], and dT are the matrix of elastoplasticity moduli, the matrix of thermal moduli, and the temperature difference, respectively. An ambient temperature of 22.5 was used as the temperature reference in this study.…”

Section: Fem Calculationsmentioning

confidence: 99%

“…11 The physical constants of the apparent activation energy, the Boltzmann constant, the convection heat-transfer coefficient, and the stress exponent were 60 (kJ/mole), 8.315 (J/moleK), 5 (W/ m 2°C ), and 4, respectively. 7,25 …”

Section: Fem Calculationsmentioning

confidence: 99%

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The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages

Sheen

Chang

Teng

et al. 2002

Journal of Elec Materi

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The joint strength and fracture surface of Pb/Sn and Au/Sn solders in laserdiode packages after thermal-aging testing were studied experimentally. Specimens were aged at 150°C for up to 49 days. The joint strength decreased as aging time increased. The microstructure and fracture surface of the Pb/Sn and Au/Sn solder joints showed that the joint strength decrease was caused by both the enlargement of the initial voids and an increase in the number of voids as aging time increased. The formation of Kirkendall voids with intermetallic-compound (IMC) growth of the Pn/Sn solder as aging time increased was also a possible mechanism for the joint-strength reduction. Finite-element method (FEM) simulations were performed on the joint-strength estimation of Pb/Sn and Au/Sn solders in thermal-aging tests. The coupled thermal-elasticity-plasticity model was used to simulate distributions of the thermal and residual stresses, creep deformation, and joint-strength variations in the solder joints under various thermal-aging tests. Simulation results were in good agreement with the experimental measurements that the solder-joint strength decreased as aging time increased. The result suggests that the FEM is an effective method for analyzing and predicting the solder-joint strength in laserdiode packages.

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