Effect of thin-film length on the peeling behavior of film-substrate interfaces

Peng, Zhilong; Yin, Hanbin; Yao, Yin; Chen, Shaohua

doi:10.1103/physreve.100.032804

Cited by 24 publications

(3 citation statements)

References 29 publications

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“…Kim and Varenberg [24] studied how the pulling angle influences the normal and tangential components of the pull-off force for wall-shaped adhesive microstructures using Kendall's peeling model [19]. Peng et al [25] studied the peeling behaviour of finite length thin-films using both theoretical and finite element models. They observed that unlike classical peeling models like Kendall's, which consider infinite film length, finite film length models lead to steady-state peeling process depending on the initial adhesion length.…”

Section: Introductionmentioning

confidence: 99%

Investigating the normal and tangential peeling behaviour of gecko spatulae using a coupled adhesion-friction model

Gouravaraju

Sauer

Gautam

2020

The Journal of Adhesion

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The present work investigates the normal and tangential peeling behaviour of a gecko spatula using a coupled adhesion-friction model. The objective is to explain the strong attachment and easy detachment behaviour of the spatulae as well as to understand the principles behind their optimum design. Using nonlinear finite element computations, it is shown that during tangentially-constrained peeling the partial sliding of the spatula pad near the peeling front stretches the spatula, thus increasing the strain energy and leading to high pull-off forces. The model is used to investigate the influence of various parameters on the pull-off forces -such as the peeling angle, spatula shaft angle, strip thickness, and material stiffness. The model shows that increasing the spatula pad thickness beyond a certain level does not lead to a significant increase in the attachment forces. Further, the easy detachment behaviour of geckos is studied under tangentially-free peeling conditions. It is found that the spatulae readily detach from the substrate by changing their shaft angle and eventually peel vertically like a tape. Since the present computational model is not limited by the geometrical, kinematical, and material restrictions of theoretical models, it can be employed to analyse similar biological adhesive systems.

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Section: Introductionmentioning

confidence: 99%

Investigating the normal and tangential peeling behaviour of gecko spatulae using a coupled adhesion-friction model

Gouravaraju

Sauer

Gautam

2020

The Journal of Adhesion

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“…Several researchers used thin film peeling models to understand various aspects of gecko adhesion such as reversible adhesion [22,24], pre-straining [18,25,26], dynamic self-cleaning [27], and adhesive friction [10,[28][29][30]. Adhesion and peeling of multiscale biological adhesives is a particularly complex phenomenon that is influenced by a wide variety of geometrical, material, and environmental parameters [15,[31][32][33]. Computational methods provide an opportunity to utilize a single framework to study the effect of these various factors [34].…”

Section: Introductionmentioning

confidence: 99%

A Bayesian regularization-backpropagation neural network model for peeling computations

Gouravaraju,

Narayan,

Sauer

et al. 2020

Preprint

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Bayesian regularization-backpropagation neural network (BR-BPNN), a machine learning algorithm, is employed to predict some aspects of the gecko spatula peeling such as the variation of the maximum normal and tangential pull-off forces and the resultant force angle at detachment with the peeling angle. The input data is taken from finite element (FE) peeling results. The neural network is trained with 75% of the FE dataset. The remaining 25% are utilized to predict the peeling behavior. The training performance is evaluated for every change in the number of hidden layer neurons to determine the optimal network structure. The relative error is calculated to draw a clear comparison between predicted and FE results. It is observed that BR-BPNN models have significant potential to estimate the peeling behavior.

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“…A vast body of literature has been devoted to the peeling of single-layer adhesives from a stiff substrate, when pulled at a prescribed angle, as evident from ample review studies (Creton and Ciccotti, 2016;Noori et al, 2016;Federle and Labonte, 2019;Skopic and Schniepp, 2020). Often the length of the layer l is assumed to be infinitely long compared to its thickness t, namely l/t → ∞ (Xia et al, 2013;Pesika et al, 2007;Yin et al, 2020;He et al, 2019a;Peng et al, 2019). At this limit, multi-layer systems simplify to a uniform thin film of averaged in-plane stiffness, and the propagation of peeling can arrive at a steady state, thus permitting the use of analytical methods (Garg and Datla, 2019;Xia et al, 2013;Peng and Chen, 2015;Sauer, 2011;Xu et al, 2019;He et al, 2019a).…”

Section: Introductionmentioning

confidence: 99%

Stick-slip phenomena and Schallamach waves captured using reversible cohesive elements

Ringoot,

Roch,

Molinari

et al. 2020

Preprint

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Reversibility is of paramount importance in the correct representation of surface peeling in various physical settings, ranging from motility in nature, to gripping devices in robotic applications, and even to sliding of tectonic plates. Modeling the detachment-reattachment sequence, known as stick-slip, imposes several challenges in a continuum framework. Here we exploit customized reversible cohesive elements in a hybrid finite element model that can handle occurrence of snap-through instabilities. The simulations capture various peeling phenomena that emerge in experimental observations, where layers are pulled from a flat, rigid substrate in the direction parallel to the surface. For long layers, periodicity in reattachment is shown to develop and is linked to the concept of Schallamach waves. Further, the connection between surface properties and stick-slip behavior is investigated: it was found that stickslip is linked to the propensity of the interface to localize deformation and damage. Beyond elucidating the various peeling behaviors and the detachment modes, the theoretical framework developed here provides a straightforward approach for investigation of complex delamination processes, which can guide development of future applications across different scales and in various settings.

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Effect of thin-film length on the peeling behavior of film-substrate interfaces

Cited by 24 publications

References 29 publications

Investigating the normal and tangential peeling behaviour of gecko spatulae using a coupled adhesion-friction model

Investigating the normal and tangential peeling behaviour of gecko spatulae using a coupled adhesion-friction model

A Bayesian regularization-backpropagation neural network model for peeling computations

Stick-slip phenomena and Schallamach waves captured using reversible cohesive elements

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