2020
DOI: 10.1016/j.surfcoat.2020.126137
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Effect of thiourea on electrocrystallization of Cu–Sn alloys from sulphate electrolytes

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Cited by 11 publications
(12 citation statements)
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“…4 shows XRD patterns of the coatings deposited in different agitation modes. The results show that the metallic matrix of obtained alloys is a single-phase substitutional solid solution of tin in copper [22] , [66] . Due to a small thickness of the coating (ca.…”
Section: Resultsmentioning
confidence: 90%
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“…4 shows XRD patterns of the coatings deposited in different agitation modes. The results show that the metallic matrix of obtained alloys is a single-phase substitutional solid solution of tin in copper [22] , [66] . Due to a small thickness of the coating (ca.…”
Section: Resultsmentioning
confidence: 90%
“…Cu–Sn alloys have the advantages of decorative appearance, high corrosion resistance, and low toxicity, which make them widely used as decorative, protective, and functional coatings [19] , [20] , [21] , [22] . Moreover, Cu–Sn coatings can be used as a promising substitution of Ni coatings, which are known to cause allergies and dermatitis when their corrosion products are in direct contact with human skin [1] , or being carcinogenic when inhaled [23] .…”
Section: Introductionmentioning
confidence: 99%
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“…The electrodeposition process was performed using an Autolab 302N potentiostat/galvanostat. The Cu pretreatment layer was cathodically deposited onto the steel surface from the following electrolyte [ 35 ]: 40 g/L of CuSO 4 × 5H 2 O, 100 g/L of H 2 SO 4 , and 3 mg/L of thiourea. The deposition was performed at a cathodic current density of 2 A/dm 2 for 25 s. A copper plate was used as the anode.…”
Section: Methodsmentioning
confidence: 99%
“…Galvanic Cu–Sn coatings containing 10–20 wt.% of tin are similar in their physical-mechanical and corrosion properties to nickel coatings, however, unlike the latter, they are hypoallergenic and have lower cost [ 18 , 19 ]. Electrochemical deposition of Cu–Sn alloys can be performed from the sulfuric acid electrolytes, which are the most versatile and easy-to-prepare type of plating bath [ 20 , 21 , 22 ]. Co-deposition of copper and tin from these electrolytes can occur at potentials that are more positive than the equilibrium potential of the Sn 2+ /Sn system (−0.14 V) due to the underpotential deposition (UPD) of tin [ 20 ].…”
Section: Introductionmentioning
confidence: 99%