Effect of tungsten (W) on structural and magnetic properties of electroplated NiFe thin films for MEMS applications

Kannan, R.; Devaki, P.; Premkumar, P. S.; Selvambikai, M.

doi:10.1088/2053-1591/aabddd

Cited by 20 publications

(5 citation statements)

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“…[48] Magnetic electroplating has also been commonly used in biological [49][50][51] and passive component research. [52][53][54][55][56] In this work, electroplating is used as a post-rolling solution to the metal thickness restriction of the S-RuM platform. With the rolled-up metal strips acting as seed layers and the introduction of "spacers" to deterministically engineer the gap between the turns, metal is electroplated between turns to increase the conducting film thickness and decrease the resistance.…”

Section: Introductionmentioning

confidence: 99%

Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces

Yang,

Khandelwal,

Wang

et al. 2024

Adv Materials Technologies

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Internet‐of‐Things and Cyber‐Physical‐System applications demand compact power converters, which require inductors to have small footprints but considerable power handling abilities. 3D air‐core tubular inductors fabricated using the self‐rolled‐up membrane (S‐RuM) technology have demonstrated significantly higher inductance density compared to conventional planar structures. However, previous design options and associated performance are constrained by the resistive loss due to the thickness of the metal and magnetic coupling limited by the air core. Here, the study reports a post‐rolling electroplating scheme aimed at enhancing the metal conductivity and core magnetic permeability in S‐RuM inductors, all while maintaining their compact footprint. A DC resistance improvement of over 10X and an inductance enhancement of over 30X are achieved by the 3D S‐RuM inductors, via parallel‐processed Cu‐electroplated strips on the cylindrical shells and partially permalloy‐electroplated core. The improvement is projected to continue to improve as the entire core is filled. This advancement paves the way for scalable applications of this technology in ultra‐compact, low‐loss passive power electronics, such as converters and filters.

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Section: Introductionmentioning

confidence: 99%

Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces

Yang,

Khandelwal,

Wang

et al. 2024

Adv Materials Technologies

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“…In recent years, researchers focus more on low dimensional conductors than bulk conductors, since low dimensionality of materials present them novel properties [11] such as superior yield strength [12] and in case of nanotubes even lower electrical resistance [13]. Intriguing properties of deposited metallic thinlms have led to different applications such as memory devices [14], micro-electro-mechanical systems (MEMS) [15], and optical devices [16]. Huang et al fabricated Cu doped ultra-thin Ag transparent conductive lms on glass and PET substrates.…”

Section: Introductionmentioning

confidence: 99%

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate 

Atta

Abdeltwab

Bek

2021

Preprint

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Copper (Cu) thin films are deposited on polyethyleneterephthalate (PET) substrate using ion-beam-sputtering technique. The formation of Cu thin films is successful confirmed as investigated by X-ray diffraction (XRD). Surface morphology of Cu/PET is studied by atomic force microscopy (AFM). The AFM results show that Cu film dewets PET surface and the surface roughness increased from 22.6 nm for PET to 45.3 nm after 40min of deposited Cu/PET. The sheet resistance decreases from 5.16x104Ω to 1.3x104Ω and resistivity decreases from 2.3x10-2Ω.cm to 1.77x10-2Ω.cm, as the Cu deposition time increases from 20min to 60min. The Young’s modulus increases from 2.82GPa to 2.96GPa and the adhesion force enhanced from 14.7nN to 29.90nN after 40min of Cu deposition. The DC electrical conductivity at 300V is improved from 1.75x10-8 S.cm-1 to 3.57x10-8 S.cm-1 after 60min of Cu deposition. The results show that ion beam deposition of Cu on flexible PET platform clearly exhibits improvement over pristine PET in the mechanical and electrical properties which renders it useful for electronics applications.

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“…In order to enhance the mechanical properties of mild steel, thin alloy coatings were preferred. There are several physical and chemical methods are available to coat the thin layers on mild steel [6][7][8][9][10]. In the present research work, electroplating have been chosen for the coating purposes due to its several advantages.…”

Section: Introductionmentioning

confidence: 99%

A Research on Niw Alloy Coatings on Mild Steel through Electrodeposition Method

2019

IJITEE

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In order to enhance the structural and mechanical properties of mild steel, NiW nanocrystalline thin layer has been coated on the surface of mild steel through electroplating technique at bath temperature of 40 C over the deposition time of 45 minutes. The nanocrystalline NiW alloy coatings were deposited on mild steel at constant current density of 1 A/dm 2 . The structural and chemical characterizations of the NiW alloy coated mild steel were performed by scanning electron microscopy (SEM) and X-ray diffraction pattern (XRD). The micro hardness value of the coated mild steel was determined by using Vickers Hardness test. The effect of NiW on wear behavior of mild steel was analyzed using Pin-on-disc apparatus. The mechanical properties of mild steel such as hardness, roughness and wear resistance have been enhanced in an appreciable manner. This is primarily due to the NiW alloy coatings on mild steel. The variations in structural and mechanical properties ofNiW coated mild steel were also studied.

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Effect of tungsten (W) on structural and magnetic properties of electroplated NiFe thin films for MEMS applications

Cited by 20 publications

References 5 publications

Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces

Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate

A Research on Niw Alloy Coatings on Mild Steel through Electrodeposition Method

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Effect of tungsten (W) on structural and magnetic properties of electroplated NiFe thin films for MEMS applications

Cited by 20 publications

References 5 publications

Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces

Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate&nbsp;

A Research on Niw Alloy Coatings on Mild Steel through Electrodeposition Method

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Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate