Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints

Zhao, Di; Zhang, Keke; Cui, Jianguo; Ma, Ning; Pan, Yibo; Yin, Chenxiang

doi:10.1007/s10854-018-0008-y

Cited by 7 publications

(8 citation statements)

References 31 publications

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“…The IMC locates at the interface of solder seam and Cu substrate, and it grows towards the solder seam as shown in Figure 4(b). Previous research has shown that the interface IMC morphology and the dimension of a lead-free solder joint influenced performance and reliability [27]. In this paper, the average thickness (d) and the roughness (R) of the IMC layer are used to characterize the morphology and size of interface IMC, and investigate its effect on the reliability of the solder joints.…”

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

“…Up to now, the Sn2.5Ag0.7Cu0.1RE0.05Ni solder was systematically studied by Zhang Keke's research group. The research includes process optimization [28], the methods (with ultrasound and electric field) improving the strength of the joint [27,29], as well as thermal shock of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints [30,31], The Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints were obtained with the soldering temperature 270 • C and the soldering time 240 s. The IMC thickness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints with same soldering technological parameter ranges from 3 and 4.3 µm [27][28][29][30][31], and the roughness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints ranges from 1.6 and 2.6 µm [27,[29][30][31]. The IMC thickness and the roughness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints are little different though with the same soldering parameter.…”

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

“…The irregular scalloped IMC grew irregularly into solder seam away from the Cu substrate interface. obtained with the soldering temperature 270 °C and the soldering time 240 s. The IMC thickness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints with same soldering technological parameter ranges from 3 and 4.3 μm [27][28][29][30][31], and the roughness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints ranges from 1.6 and 2.6 μm [27,[29][30][31]. The IMC thickness and the roughness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joints are little different though with the same soldering parameter.…”

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

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The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Cao

Zhang

Shi

et al. 2019

Metals

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The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

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Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

Section: Microstructure Of Sn25ag07cu01rexni/cu Solder Joints Aftementioning

confidence: 99%

See 3 more Smart Citations

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Cao

Zhang

Shi

et al. 2019

Metals

Self Cite

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show abstract

Understanding the formation mechanism of SiC/Al joints by U-TLP bonding with the inactive Zn interlayer

Zhao,

Xiu

et al. 2024

Journal of Materials Science & Technology

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Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Cui

Zhang

Zhao

et al. 2021

Sci Rep

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Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

show abstract

Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints

Cited by 7 publications

References 31 publications

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Understanding the formation mechanism of SiC/Al joints by U-TLP bonding with the inactive Zn interlayer

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

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