“…5 Also power dissipation in memory devices is due to the leakage current through the gate dielectric material. 7 Various multilayer structures with BST as the main constituent have been studied such as BST/ SiO 2 / BST, BST/ ZrO 2 / BST, BST/ Ba 0.8 Sr 0.2 Ce x Ti 1−x O 3 ͑BSCT͒ / BST, ͑Ba, Sr͒TiO 3 / MgO/ ͑Ba, Sr͒TiO 3 ͑BST/MgO/BST͒, Ba͑Zr, Ti͒O 3 / BST/ Ba͑Zr, Ti͒O 3 ͑BZT/BST/BZT͒, etc., [8][9][10][11][12] and different properties enhancement have been also reported. Tremendous effort has been made to optimize the dielectric as well as electrical properties of BST thin films for different device applications.…”