2016
DOI: 10.1016/j.ijleo.2015.09.074
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Effect of UV radiation surface damage on silicon position sensitive photodetector

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Cited by 8 publications
(4 citation statements)
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“…The origin of this recombination might be attributed to a competition between hydrogen reduction, under high reverse bias potentials in the dark, and the SiO 2 surface layer reduction. Furthermore, several studies have reported UV-induced degradation of SiO 2 [39][40][41], decreasing the overpotential at the interface. Overall, a considerable evolution in the current density recorded under illumination is observed at the same potential at which the dark current density increases as a result of the SiO 2 reduction.…”
Section: Photoelectrochemical Characterizationmentioning
confidence: 99%
“…The origin of this recombination might be attributed to a competition between hydrogen reduction, under high reverse bias potentials in the dark, and the SiO 2 surface layer reduction. Furthermore, several studies have reported UV-induced degradation of SiO 2 [39][40][41], decreasing the overpotential at the interface. Overall, a considerable evolution in the current density recorded under illumination is observed at the same potential at which the dark current density increases as a result of the SiO 2 reduction.…”
Section: Photoelectrochemical Characterizationmentioning
confidence: 99%
“…Because the fits are only an approximation of the real profiles, the layers in the fit do not necessarily represent an actual stratified film; thus, the remaining parameters are not constrained to a priori specified physically realistic values. Because UV radiation is known to modify the structure of oxide layers on silicon wafers , (see also Table S2 and related comments on this in the Supporting Information), the substrate parameters from the previous fit (after the first polymer layers) were not directly adapted for these fits, but they were determined once again.…”
Section: Materials and Methodsmentioning
confidence: 99%
“…Moreover, the MSM photodetectors have high operation speed and low capacitance leading to simple integration with field effect transistors in a single chip without complicated fabrication steps [4,5]. As the demand for harsh environment electronic and photonic applications increases, Si cannot meet these requirements mainly due to the limitations in UV radiation resistance and operation temperature (below 150 °C) [6,7]. As an alternative to Si, wide bandgap (WBG) semiconductors such as SiC [8][9][10][11], GaN [12][13][14], and ZnO [15,16] are good candidates for fabricating optoelectronic devices capable of operating in harsh environments.…”
Section: Introductionmentioning
confidence: 99%