2014
DOI: 10.1149/2.056404jes
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Effect of Vacuum System Base Pressure on Corrosion Resistance of Sputtered Al Thin Films

Abstract: Pure aluminum (Al) thin films were sputter deposited under conditions of variable base pressure of the deposition tool. The purpose of the study was to identify if the base pressure had a key influence on the electrochemical properties, namely corrosion resistance, of the Al deposits. The corrosion resistance was found to increase with increasingly high base pressure (i.e. lower quality vacuum). Potentiodynamic polarization experiments, pit growth studies, TEM and XPS were employed. From the results is posited… Show more

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Cited by 33 publications
(15 citation statements)
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“…Recent work indicated that oxygen contamination of sputtering-deposited aluminum films originated mainly from residual water molecules in the sputtering chamber. 29 A base pressure of 10 −7 torr was required to reduce the contamination to levels that did not significantly affect the corrosion behavior of the films. The level is similar to the base pressure achieved in the present work.…”
Section: Resultsmentioning
confidence: 99%
“…Recent work indicated that oxygen contamination of sputtering-deposited aluminum films originated mainly from residual water molecules in the sputtering chamber. 29 A base pressure of 10 −7 torr was required to reduce the contamination to levels that did not significantly affect the corrosion behavior of the films. The level is similar to the base pressure achieved in the present work.…”
Section: Resultsmentioning
confidence: 99%
“…The deleterious influence of Al-Cr intermetallics on corrosion resistance was attenuated by their refined size and increased Cr content in solid solution. Moreover, incorporation of elements, i.e., N or O from high-energy ball milling atmosphere and their presence in solid solution is expected to improve corrosion resistance [67].…”
Section: Discussionmentioning
confidence: 99%
“…More recently, it has been shown that a significant amount of O was incorporated in sputter deposited Al [241]. The incorporation of O to the sputtered Al film is attributed to the enhanced pitting resistance [242]. These studies could be very important in explaining improved corrosion resistance of nanocrystalline SS.…”
Section: Incorporation Of Elements From Processing Mediamentioning
confidence: 97%