Ru-induced deep levels in 50 μm n-type 4H-SiC epitaxial layers were investigated by Deep Level Transient Spectroscopy (DLTS). Schottky diodes were fabricated by radio frequency (RF) sputtering thin layers of Ru metal on the epilayer surface and graphite paste for back Ohmic contact. Current-Voltage measurements (I-V) revealed a high barrier height of 1.70 eV and a diode ideality factor of 1.2 at room temperature (300 K). An effective carrier concentration of 4.34 × 10 14 cm −3 was determined from a Mott-Schottky plot of the Capacitance-Voltage (C-V) measurements. DLTS studies revealed seven prominent defect levels at 0.12 ± 0.02, 0.17 ± 0.01, 0.65 ± 0.01, 0.89 ± 0.03, 1.26 ± 0.04, 1.53 ± 0.06, and 1.98 ± 0.03 eV below the conduction band edge. Defect data reported in the literature suggests the new defect level of E C -(0.89 ± 0.03) eV may be correlated to Ru-induced defect formation in 4H-SiC epitaxial layer. The defect level observed at E C -(1.98 ± 0.03) eV has been observed for the first time in 50 μm 4H-SiC epilayer following Ru Schottky barrier formation and subsequent rapid thermal annealing (RTA) and this deep level has not been reported elsewhere.Silicon carbide is poised to be the high performance alternative to silicon-based devices due to its superior material properties. A wide bandgap (3.27 eV at 300 K) and large displacement energy (22-35 eV) for 4H-SiC allows devices to be operated well above room temperature and in high radiation environments without the need for bulky cryogenic cooling systems such as those used with silicon (Si) and germanium (Ge) based radiation detectors. 1 High breakdown electric field (3.0 × 10 6 V cm −1 ) and high thermal conductivity (4.9 W cm −1 K −1 ) 2 many times higher compared to Si (1.5 W cm −1 K −1 ) 2 and CdZnTe (∼9.7 × 10 −3 W cm −1 K −1 ) 3 enables high voltage operation with effective heat dissipation. Device operation in high performance applications requires the formation of metal contacts with excellent thermodynamic stability and high Schottky barriers for good current rectification. The challenge in producing consistently good Schottky contacts depends on the surface preparation of the semiconductor and how easily the contact metal diffuses into the semiconductor at the temperatures in which the device will operate.In this study, we explore the use of ruthenium (Ru) as a Schottky contact on n-type 4H-SiC epilayers and investigate defect levels induced from radio frequency (RF) sputtering and rapid thermal annealing (RTA) of the Ru Schottky contacts in the 4H-SiC epilayers. Ru is a high work function (φ Ru = 4.71 eV) rare earth transition metal with excellent physical, chemical, and electrical properties. 4 In spite of these excellent properties of Ru, there are limited literatures available on deep-level studies on Ru/4H-SiC Schottky barriers. 5-8 Experimental A 10 × 10 mm 2 sample was diced from a 4H-SiC (0001) wafer with an 8 • off-cut toward the [1120] direction highly doped with nitrogen. 50 μm epilayers were grown by hot wall chemical vapor deposition...