Effect of zein subunit and plasticizer on rheology and adhesion properties of zein-based adhesives

Zhang, Xinrui; Xu, Miaojie; Zhang, Yingying; Li, Juyang; Wang, Jieru; Hu, Yayun; Luan, Guangzhong

doi:10.1016/j.indcrop.2022.115398

Cited by 6 publications

(2 citation statements)

References 46 publications

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“… Compared with zein powder, the three nanoparticles exhibited obviously lower contents of the α-helix (∼28% vs 34%) and β-sheets (∼30% vs 34%) and higher contents of β-turns (∼16% vs 11%) and unordered coils (∼25% vs 21%). Such an obvious change of the secondary structure (from powder to nanoparticles) is consistent with the dissolution of zein chains (from powder to free chains) and the subsequent assembly of chains to nanoparticles (due to antisolvent), which involves the hydrogen bond breaking and generation of intermolecular/intramolecular hydrogen bonds. , Among zein nanoparticles, P 65 displayed a lower content of β-sheets but a higher content of β-turns than P 75 and P 85 , which can be attributed to the higher content of the antisolvent (water) during the assembly process . SEM images clearly demonstrate the feature of spherical nanoparticles of P 65 , P 75 , and P 85 (with average diameters of 164 ± 55, 206 ± 76, and 212 ± 73 nm, respectively), which were different from the pristine irregular zein powder (Figure d,e and Figure S2, Supporting Information).…”

Section: Resultssupporting

confidence: 56%

“…20,25 Among zein nanoparticles, P 65 displayed a lower content of β-sheets but a higher content of β-turns than P 75 and P 85 , which can be attributed to the higher content of the antisolvent (water) during the assembly process. 26 SEM images clearly demonstrate the feature of spherical nanoparticles of P 65 , P 75 , and P 85 (with average diameters of 164 ± 55, 206 ± 76, and 212 ± 73 nm, respectively), which were different from the pristine irregular zein powder (Figure 2d,e and Figure S2, Supporting Information). All the results indicate that the three zein nanoparticles were well-prepared by the antisolvent method with varied ethanol/water contents.…”

Section: ■ Results and Discussionmentioning

confidence: 97%

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A Janus Gelatin Sponge with a Procoagulant Nanoparticle-Embedded Surface for Coagulopathic Hemostasis

Wang,

Lin,

et al. 2023

ACS Appl. Mater. Interfaces

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Apart from the wide and safe application of natural polymerbased hemostatic materials/devices, it is still desirable to develop new types of hemostatic materials that can achieve both potent coagulopathic hemostasis and a facile preparation process. In this work, one Janus gelatin sponge (J-ZGS) is readily constructed for both coagulation-dependent and coagulopathic hemostasis by embedding zein nanoparticles on the surface of a self-prepared gelatin sponge (S-GS): zein nanoparticles were facilely prepared by an antisolvent method to achieve procoagulant blood−material interactions, while S-GS was prepared by freeze-drying a foaming gelatin solution. Due to the distinct secondary structure, the optimal zein nanoparticles possessed a higher in vitro hemostatic property than the pristine zein powder and other nanoparticles, the underlying mechanism of which was revealed as the superior RBC/platelet adhesion property in the presence/absence of plasma proteins. Compared with S-GS and a commercial gelatin sponge, J-ZGS achieved a significantly higher in vitro hemostatic property and similarly good blood compatibility/cytocompatibility. Moreover, in vivo artery-injury models confirmed the outstanding hemostatic performance of J-ZGS under both coagulation-dependent and coagulopathic conditions. Our work offers an appealing approach for developing potent hemostatic sponges from natural polymer-based nanoparticles that could be further extended to versatile hemostatic materials for coagulopathic hemostasis.

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Section: Resultssupporting

confidence: 56%

Section: ■ Results and Discussionmentioning

confidence: 97%

A Janus Gelatin Sponge with a Procoagulant Nanoparticle-Embedded Surface for Coagulopathic Hemostasis

Wang,

Lin,

et al. 2023

ACS Appl. Mater. Interfaces

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A Corn‐Based Electrically Conductive Glue for Integration of Edible Electronics

Contreras‐Pereda,

Galli,

Cataldi

et al. 2024

Small Science

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Edible electronics leverages the electronic properties of food‐grade materials to create non‐toxic technologies that can be either environmentally degraded or digested by the body after the completion of their function. Various edible electronic components have been recently proposed, and their integration into more complex circuits and systems is urgently needed for point‐of‐care devices. In this context, developing a safe technology for interconnecting edible components is crucial. To this aim, here an edible electrically conductive adhesive made from zein, an edible protein derived from corn, and activated carbon, a food additive, are reported. Different formulations are proposed depending on the ratio between adhesive binder (zein) and electrically conductive filler (activated carbon), evidencing a trade‐off between resistivity and adhesion, passing from a 3 × 103 Ω cm resistivity and 2 MPa lap shear adhesion strength to 5 × 102 Ω cm and 0.5 MPa values upon increasing the filler content. As a proof‐of‐concept, the conductive adhesive is validated in different applications relevant to edible electronics, such as mounting devices on top of innovative edible substrates, interconnecting state‐of‐the‐art edible batteries, and conforming highly adhesive electrodes for fruit monitoring.

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Plastic-free and smart packaging: Consumers’ sustainable choices and convenience

Drago,

Campardelli,

Perego

2024

Reference Module in Food Science

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Effect of zein subunit and plasticizer on rheology and adhesion properties of zein-based adhesives

Cited by 6 publications

References 46 publications

A Janus Gelatin Sponge with a Procoagulant Nanoparticle-Embedded Surface for Coagulopathic Hemostasis

A Janus Gelatin Sponge with a Procoagulant Nanoparticle-Embedded Surface for Coagulopathic Hemostasis

A Corn‐Based Electrically Conductive Glue for Integration of Edible Electronics

Plastic-free and smart packaging: Consumers’ sustainable choices and convenience

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